-
公开(公告)号：US10078007B2
公开(公告)日：2018-09-18
申请号：US15404013
申请日：2017-01-11
Inventor： Takafumi Okudo , Takahiro Miyatake , Yoshiharu Sanagawa , Masao Kirihara , Yoichi Nishijima , Takanori Aketa , Ryo Tomoida
IPC: G01J1/04
CPC classification number: G01J1/0403 , G01J1/04 , G01J1/0407 , G01J1/0411 , G01J1/0437 , G01J5/0025 , G01J5/02 , G01J5/0235 , G01J5/06 , G01J5/0806 , G01J5/0831
Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.
-
公开(公告)号：US20150287696A1
公开(公告)日：2015-10-08
申请号：US14420181
申请日：2013-03-11
Inventor： Mitsuhiko Ueda , Yoshiharu Sanagawa , Takanori Aketa , Shintaro Hayashi
IPC: H01L23/00
CPC classification number: H01L24/97 , B23K20/00 , H01L21/52 , H01L21/6836 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2221/68327 , H01L2221/68381 , H01L2224/04026 , H01L2224/05155 , H01L2224/05166 , H01L2224/05664 , H01L2224/05669 , H01L2224/2745 , H01L2224/2746 , H01L2224/29011 , H01L2224/29012 , H01L2224/29013 , H01L2224/2908 , H01L2224/29082 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/3003 , H01L2224/32225 , H01L2224/32227 , H01L2224/32501 , H01L2224/32505 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/75252 , H01L2224/75301 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75901 , H01L2224/7598 , H01L2224/8301 , H01L2224/83013 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83123 , H01L2224/83127 , H01L2224/83193 , H01L2224/83203 , H01L2224/83207 , H01L2224/83805 , H01L2224/83825 , H01L2224/8383 , H01L2224/83906 , H01L2224/83907 , H01L2224/92247 , H01L2224/97 , H01L2924/01322 , H01L2924/10161 , H01L2924/10162 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2224/83 , H01L2924/0105 , H01L2924/00014 , H01L2924/01032 , H01L2924/01083 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
Abstract translation: 将芯片安装在基板上的安装方法包括临时粘合工艺和主要粘结工艺。 暂时粘接过程是根据芯片的数量重复执行第一个基本过程。 第一基本过程包括第一步骤和第二步骤。 第一步是在衬底的第一金属层上对准每个芯片的第二金属层。 第二步是通过使第一和第二金属层进行固相扩散接合来临时粘合每个芯片。 主键合过程是根据芯片的数量重复执行第二个基本过程。 第二基本过程包括第三步骤和第四步骤。 第三步是识别临时安装在基板上的每个芯片的位置。 第四步是通过使第一和第二金属层进行液相扩散接合来牢固地结合每个芯片。
-
公开(公告)号：US09997685B2
公开(公告)日：2018-06-12
申请号：US14916308
申请日：2014-09-03
Inventor： Takanori Aketa , Mitsuhiko Ueda , Toru Hirano
CPC classification number: H01L33/62 , H01L24/14 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/44 , H01L33/486 , H01L33/641 , H01L2924/01322 , H01L2933/0066 , H01L2924/00
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
-
公开(公告)号：US09818923B2
公开(公告)日：2017-11-14
申请号：US15503872
申请日：2015-10-27
Inventor： Mitsuhiko Ueda , Yoshiharu Sanagawa , Takanori Aketa
CPC classification number: H01L33/62 , H01L33/32 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/56 , H01L2224/16145 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/16152 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.
-
公开(公告)号：US12009586B2
公开(公告)日：2024-06-11
申请号：US17429144
申请日：2020-02-06
Inventor： Takuya Mino , Takanori Aketa
Abstract: The conductive device includes a substrate and an electrically conductive portion. The electrically conductive portion is provided on the substrate. The electrically conductive portion includes an electrically conductive part and a low resistance conductive layer. The electrically conductive part is provided on the substrate and includes an electrically conductive particle and an organic binder. The low resistance conductive layer covers at least part of a surface of the electrically conductive part and has lower resistivity than the electrically conductive part.
-
Patent Agency Ranking
公开(公告)号：US11852316B2
公开(公告)日：2023-12-26
申请号：US17915868
申请日：2021-03-16
Inventor： Hiroshi Kitano , Kenichiro Tanaka , Takanori Aketa , Yoshiyuki Takegawa , Satoshi Hyodo
Abstract: A construction component forms at least a part of a structure that faces a target space. The construction component has a first function, a second function, and a third function. The first function is a function of emitting illumination light toward the target space. The second function is a function of allowing incident light to enter the construction component. The incident light is emitted from a light source disposed out of a projection area, viewed from the target space, of the construction component and is incident on the construction component via a light transmission member. The third function is a function of converting the incident light into the illumination light.
-
公开(公告)号：US09508679B2
公开(公告)日：2016-11-29
申请号：US14420181
申请日：2013-03-11
Inventor： Mitsuhiko Ueda , Yoshiharu Sanagawa , Takanori Aketa , Shintaro Hayashi
IPC: H01L23/00 , B23K20/00 , H01L21/52 , H01L21/683
CPC classification number: H01L24/97 , B23K20/00 , H01L21/52 , H01L21/6836 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2221/68327 , H01L2221/68381 , H01L2224/04026 , H01L2224/05155 , H01L2224/05166 , H01L2224/05664 , H01L2224/05669 , H01L2224/2745 , H01L2224/2746 , H01L2224/29011 , H01L2224/29012 , H01L2224/29013 , H01L2224/2908 , H01L2224/29082 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/3003 , H01L2224/32225 , H01L2224/32227 , H01L2224/32501 , H01L2224/32505 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/75252 , H01L2224/75301 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75901 , H01L2224/7598 , H01L2224/8301 , H01L2224/83013 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83123 , H01L2224/83127 , H01L2224/83193 , H01L2224/83203 , H01L2224/83207 , H01L2224/83805 , H01L2224/83825 , H01L2224/8383 , H01L2224/83906 , H01L2224/83907 , H01L2224/92247 , H01L2224/97 , H01L2924/01322 , H01L2924/10161 , H01L2924/10162 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2224/83 , H01L2924/0105 , H01L2924/00014 , H01L2924/01032 , H01L2924/01083 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
Abstract translation: 将芯片安装在基板上的安装方法包括临时粘合工艺和主要粘结工艺。 暂时粘接过程是根据芯片的数量重复执行第一个基本过程。 第一基本过程包括第一步骤和第二步骤。 第一步是在衬底的第一金属层上对准每个芯片的第二金属层。 第二步是通过使第一和第二金属层进行固相扩散接合来临时粘合每个芯片。 主键合过程是根据芯片的数量重复执行第二个基本过程。 第二基本过程包括第三步骤和第四步骤。 第三步是识别临时安装在基板上的每个芯片的位置。 第四步是通过使第一和第二金属层进行液相扩散接合来牢固地结合每个芯片。
-
公开(公告)号：US12292166B2
公开(公告)日：2025-05-06
申请号：US18252673
申请日：2021-10-14
Inventor： Hiroshi Kitano , Takanori Aketa , Taisuke Nishimori , Kenichiro Tanaka
IPC: F21K9/64 , F21V1/04 , F21V33/00 , F21Y113/10 , F21Y115/30
Abstract: A lighting system includes a light source unit and a light-distributing member. The light source unit includes a laser light source. The light-distributing member has the function of reflecting incident light that has been emitted as a beam of light from the light source unit toward a target space. The light-distributing member transforms the incident light into lighting light having a different light distribution property from the incident light and distributes the lighting light over the target space.
-
公开(公告)号：US11985452B2
公开(公告)日：2024-05-14
申请号：US17270622
申请日：2019-07-23
Inventor： Takanori Aketa , Yosuke Honda , Takashi Kishida , Toru Hirano
CPC classification number: H04N9/3158 , G02B5/206 , G02B5/285 , H04N9/3152 , H04N9/3161
Abstract: A color conversion element includes: a substrate; a phosphor portion that is disposed above the substrate, receives laser light transmitted from an outside, and emits light in a color different from a color of the laser light; a reflective layer that includes a dielectric multilayer film and is disposed on a principal surface of the phosphor portion facing the substrate; and a joining portion interposed between the reflective layer and the substrate to join the reflective layer and the substrate. The joining portion includes an air layer that exposes the reflective layer in a position where the air layer at least partially overlaps an irradiation region in a plan view, the irradiation region being a region irradiated with the laser light on the phosphor portion.
-
公开(公告)号：US10535807B2
公开(公告)日：2020-01-14
申请号：US15974316
申请日：2018-05-08
Inventor： Takanori Aketa , Mitsuhiko Ueda , Toru Hirano
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.018 seconds)
