公开(公告)号：US10709050B2

公开(公告)日：2020-07-07

申请号：US15873165

申请日：2018-01-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Toshihide Otsuka ,  Yasutomo Terashima ,  Yuji Nakamura

IPC: H05K13/04 ,  H05K13/08

Abstract: A component management system includes an acquirer that acquires the component information from the component supply device, a management system side storage that stores the component information acquired by the acquirer in association with the component supply device, and an information updater that updates the component information stored in the component supply device side storage and the management system side storage based on a detection result of the detector.

公开(公告)号：US11156989B2

公开(公告)日：2021-10-26

申请号：US15952309

申请日：2018-04-13

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsushi Oohori ,  Toshihide Otsuka ,  Ryo Senoo

IPC: G05B19/418 ,  H05K13/02 ,  H05K13/08

Abstract: A material management apparatus (management computer) includes a production plan acquirer that acquires production plan information including a type of a material (cream solder) for bonding a component to a substrate, the material being used for production of a mounting substrate obtained by mounting the component on the substrate; a material status acquirer that acquires material status information on the material preserved in a material preservatory which preserves an accommodating portion (solder pot) in which the material is accommodated; and a material preparation instructor that creates and transmits an instruction to prepare the accommodating portion to be put out from the material preservatory, based on the production plan information and the material status information.