公开(公告)号：US20130270583A1

公开(公告)日：2013-10-17

申请号：US13859428

申请日：2013-04-09

Applicant: Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Masahiro NAKAGAWA ,  Makoto YAMAMOTO ,  Yoshihide ISOBE

IPC: H01L33/00 ,  H01L21/48

CPC classification number: H01L33/0095 ,  G02F2001/136295 ,  H01L21/321 ,  H01L21/32134 ,  H01L21/4814 ,  H01L27/124

Abstract: A method of forming a copper wiring includes forming a copper film on a substrate; forming a resist on the copper film in accordance with a predetermined pattern; forming an oxide film on the copper film on which the resist is formed; etching the copper film on which the oxide film is formed; and removing the resist after the etching of the copper film.

Abstract translation: 一种形成铜布线的方法包括在基板上形成铜膜; 根据预定图案在铜膜上形成抗蚀剂; 在其上形成有抗蚀剂的铜膜上形成氧化膜; 蚀刻形成有氧化膜的铜膜; 并且在蚀刻铜膜之后去除抗蚀剂。