利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.018 秒)

    Small format optical subassembly
    1.
    发明授权
    Small format optical subassembly 失效
    小格式光学组件

    公开(公告)号：US06331992B1

    公开(公告)日：2001-12-18

    申请号：US09545087

    申请日：2000-04-07

    申请人： Patrick B. Gilliland ,  Carlos Jines ,  Theodore Washburn

    发明人： Patrick B. Gilliland ,  Carlos Jines ,  Theodore Washburn

    IPC分类号： H01S319

    CPC分类号： H01S5/02248 ,  H01L2224/48091 ,  H01S5/02208 ,  H01L2924/00014

    摘要： A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region. The second and third through-holes protrude through the second region. The first via is electrically connected to the electrically conductive plating material adhered to the first region. The optical diode and the monitor diode both have leads which are mounted on the electrically conductive plating of the first region. A first conductor electrically connects another lead of the optical diode to the second via, and a second conductor electrically connects another lead of the monitor diode to the third via.

    摘要翻译： 小格式的光电封装或器件包括由导电罐部分地覆盖的非导电衬底。 导电罐具有固定到导电罐的孔的透明元件。 导电罐可封闭并密封光二极管，监视二极管和导电罐与非导电基板之间的导体。 非导电基板具有通过非导电基板的厚度形成的三个通孔。 三个通孔填充有导电材料，以形成三个导电通孔。 此外，非导电基板的表面被组织成三个区域。 第一和第三区域具有施加到其上的导电电镀材料。 第一通孔突出穿过第一区域。 第二和第三通孔突出穿过第二区域。 第一通孔电连接到粘附到第一区域的导电电镀材料。 光二极管和监视二极管都具有安装在第一区域的导电电镀上的引线。 第一导体将光二极管的另一引线电连接到第二通孔，并且第二导体将监视二极管的另一引线电连接到第三通孔。

    Small format optical subassembly
    2.
    发明授权
    Small format optical subassembly 失效
    小格式光学组件

    公开(公告)号：US06349105B1

    公开(公告)日：2002-02-19

    申请号：US09584455

    申请日：2000-05-31

    申请人： Patrick B. Gilliland ,  Carlos Jines ,  Theodore Washburn ,  Scott Erickson ,  Gregg Rapala

    发明人： Patrick B. Gilliland ,  Carlos Jines ,  Theodore Washburn ,  Scott Erickson ,  Gregg Rapala

    IPC分类号： H01S319

    CPC分类号： H01S5/02248 ,  H01L2224/48091 ,  H01S5/02208 ,  H01L2924/00014

    摘要： A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into two regions. The first region has the electrically conductive plating material applied thereto. The first and second through-holes protrudes through the second region. The optical diode has a first lead electrically connected to the first via, and the optical diode has a second lead electrically connected to the second via.

    摘要翻译： 小格式的光电封装或器件包括由导电罐部分地覆盖的非导电衬底。 导电罐具有固定到导电罐的孔的透明元件。 导电罐可封闭并密封光二极管，以及在导电罐和非导电基板之间的导体。 非导电基板具有通过非导电基板的厚度形成的两个通孔。 两个通孔填充有导电材料，以形成两个导电通孔。 另外，非导电基板的表面被组织成两个区域。 第一区域具有施加到其上的导电电镀材料。 第一和第二通孔突出穿过第二区域。 光二极管具有电连接到第一通孔的第一引线，并且光二极管具有电连接到第二通孔的第二引线。

    Optical package with alignment means and method of assembling an optical package
    3.
    发明授权
    Optical package with alignment means and method of assembling an optical package 有权
    具有对准装置的光学封装以及组装光学封装的方法

    公开(公告)号：US06283644B1

    公开(公告)日：2001-09-04

    申请号：US09309654

    申请日：1999-05-10

    申请人： Patrick B. Gilliland ,  Leonid Shatskin ,  Roger Weiss ,  Scott Erickson ,  Theodore Washburn

    发明人： Patrick B. Gilliland ,  Leonid Shatskin ,  Roger Weiss ,  Scott Erickson ,  Theodore Washburn

    IPC分类号： G02B636

    CPC分类号： G02B6/4204 ,  G02B6/4225 ,  G02B6/4237 ,  G02B6/4238 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4251 ,  G02B6/4263 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optical package is provided including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The ferrule receiving bore includes a longitudinal slot extending generally parallel to the axis of the bore providing radial flexibility to the outer wall. Additionally, a split sleeve is provided for accepting a fiber optic connector ferrule. The split sleeve being insertable and expandable in a ferrule receiving bore of an optical package housing. The split sleeve being retained in the ferrule receiving bore with an adhesive.

    摘要翻译： 提供了一种光学包装件，包括具有第一和第二端部的壳体。 在第一端形成套圈接收孔，在第二端形成光学腔。 光学腔和套圈接收孔沿着由封装限定的光轴彼此轴向对准。 安装盖插入光学腔上，并与壳体的外表面摩擦接合。 端盖包括端板和其上安装有光学装置的基板。 套圈接收孔包括一个纵向槽，该纵向槽基本上平行于孔的轴线延伸，向外壁提供径向的柔性。 此外，提供用于接收光纤连接器套圈的分开套筒。 开口套筒可插入并可扩展到光学包装壳体的套圈接收孔中。 分开的套筒用粘合剂保持在套圈接收孔中。