公开(公告)号：US20150292098A1

公开(公告)日：2015-10-15

申请号：US14686184

申请日：2015-04-14

申请人： Patrick Benaben ,  Joan Brennecke ,  Edward Maginn ,  Mauricio Quiroz-Guzman

发明人： Patrick Benaben ,  Joan Brennecke ,  Edward Maginn ,  Mauricio Quiroz-Guzman

IPC分类号： C25D3/10

CPC分类号： C25D3/10 ,  C25D3/06 ,  C25D3/08 ,  C25D3/665 ,  C25D5/16 ,  C25D7/00 ,  C25D9/08

摘要： An electrolyte and a method to electroplate a metal on a substrate using the electrolyte are described. The electrolyte includes an imidazolium compound, a metal salt, and water. The imidazolium compound has formula (I) wherein R1, R2, R3, R4, and R5 are each independently selected from an H atom and an organic radical. L− is a compatible anion. The metal salt can include but is not limited to salts of the metals Li, Mg, Ca, Cr, Mn, Fe, Co, Ni, Cu, Zn, Cd, Pb, Bi, La, Ce, Al, Ag, Au, Ga, V, In, Nb, Mo, and W.

摘要翻译： 描述了使用电解质对基板上的金属进行电镀的电解质和方法。 电解质包括咪唑鎓化合物，金属盐和水。 咪唑鎓化合物具有式（I），其中R 1，R 2，R 3，R 4和R 5各自独立地选自H原子和有机基团。 L-是相容的阴离子。 金属盐可以包括但不限于金属Li，Mg，Ca，Cr，Mn，Fe，Co，Ni，Cu，Zn，Cd，Pb，Bi，La，Ce，Al，Ag，Au， Ga，V，In，Nb，Mo和W.

公开(公告)号：US11105013B2

公开(公告)日：2021-08-31

申请号：US14686184

申请日：2015-04-14

申请人： Patrick Benaben ,  Joan Brennecke ,  Edward Maginn ,  Mauricio Quiroz-Guzman

发明人： Patrick Benaben ,  Joan Brennecke ,  Edward Maginn ,  Mauricio Quiroz-Guzman

IPC分类号： C25D3/10 ,  C25D3/66 ,  C25D3/06 ,  C25D3/08

摘要： An electrolyte and a method to electroplate a metal on a substrate using the electrolyte are described. The electrolyte includes an imidazolium compound, a metal salt, and water. The imidazolium compound has formula (I) wherein R1, R2, R3, R4, and R5 are each independently selected from an H atom and an organic radical. L− is a compatible anion. The metal salt can include but is not limited to salts of the metals Li, Mg, Ca, Cr, Mn, Fe, Co, Ni, Cu, Zn, Cd, Pb, Bi, La, Ce, Al, Ag, Au, Ga, V, In, Nb, Mo, and W.