Method and apparatus for material processing
    1.
    发明申请
    Method and apparatus for material processing 失效
    材料加工方法和装置

    公开(公告)号:US20060278620A1

    公开(公告)日:2006-12-14

    申请号:US11401114

    申请日:2006-04-10

    IPC分类号: B23K26/08 B23K26/14

    摘要: An apparatus processes a surface of an inhabitable structure. The apparatus includes a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit includes an energy wave generator and a head coupled to the energy wave generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further includes a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.

    摘要翻译: 一种装置处理可居住结构的表面。 该装置包括适于向相互作用区域提供能量波的基本单元,该能量波从该结构移除材料。 基本单元包括能量波发生器和耦合到能量波发生器的头部。 头适于从相互作用区域移除材料,从而减少对结构内的活动的破坏。 该装置还包括操纵系统,该操纵系统包括适于可释放地联接到该结构的锚固机构,以及联接到该锚定机构并联接到头部的定位机构。 操纵系统适于可控地调节头部相对于结构的位置。 该装置还包括电耦合到基座单元的控制器。 控制器适于响应于用户输入将控制信号发送到基本单元。

    Manipulation apparatus for system that removes material from a surface of a structure
    2.
    发明申请
    Manipulation apparatus for system that removes material from a surface of a structure 失效
    用于从结构表面去除材料的系统的操纵装置

    公开(公告)号:US20060196861A1

    公开(公告)日:2006-09-07

    申请号:US11401116

    申请日:2006-04-10

    IPC分类号: B23K26/08

    摘要: A manipulation system controllably moves a head relative to a surface of an inhabitable structure for irradiating the surface with energy waves from the head. The manipulation system includes a positioning mechanism coupled to the head. The positioning mechanism includes a first-axis position system adapted to move the head along a first direction substantially parallel to the surface. The positioning mechanism further includes a second-axis position system coupled to the first-axis position system and adapted to move the head along a second direction substantially parallel to the surface. The manipulation system further includes an anchoring mechanism coupled to the positioning mechanism and releasably coupled to the structure.

    摘要翻译: 操纵系统可控制地相对于可居住结构的表面移动头部,以用头部的能量波照射表面。 该操纵系统包括一个联接到头部的定位机构。 定位机构包括适于沿着基本平行于表面的第一方向移动头部的第一轴位置系统。 定位机构还包括耦合到第一轴位置系统并适于沿着基本上平行于表面的第二方向移动头部的第二轴位置系统。 操纵系统还包括联接到定位机构并且可释放地联接到结构的锚定机构。

    Method and apparatus for material processing
    3.
    发明申请
    Method and apparatus for material processing 失效
    材料加工方法和装置

    公开(公告)号:US20070189347A1

    公开(公告)日:2007-08-16

    申请号:US11653081

    申请日:2007-01-12

    IPC分类号: H01S3/00

    摘要: An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.

    摘要翻译: 一种装置处理可居住结构的表面。 该装置包括适于向相互作用区域提供激光的激光基座单元,该结构的激光去除材料。 激光基座单元包括激光发生器和耦合到激光发生器的激光头。 激光头适于从相互作用区域去除材料,从而减少对结构内活动的破坏。 该装置还包括适于可释放地联接到结构并且可释放地联接到激光头的锚定机构。 该装置还包括电耦合到激光基座单元的控制器。 控制器适于响应于用户输入将控制信号发送到激光基座单元。

    Method and apparatus for material processing
    4.
    发明申请
    Method and apparatus for material processing 失效
    材料加工方法和装置

    公开(公告)号:US20060062265A1

    公开(公告)日:2006-03-23

    申请号:US11205290

    申请日:2005-08-16

    IPC分类号: H01S3/00

    摘要: An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit which irradiates an interaction region with laser light, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head includes a containment plenum which confines and removes material from the interaction region. The containment plenum includes a rubber seal which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region, and providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller transmits control signals to the laser base unit in response to user input.

    摘要翻译: 一种装置处理可居住结构的表面。 该装置包括:用激光照射相互作用区域的激光基座单元,该结构中的激光去除材料。 激光基座单元包括激光发生器和耦合到激光发生器的激光头。 激光头包括限制并从相互作用区域去除材料的容纳气室。 容纳气室包括橡胶密封件,其接触结构并且基本上围绕相互作用区域,从而有助于材料从相互作用区域的限制和移除,并且减少对结构内活动的破坏。 该装置还包括可释放地联接到结构并且可释放地联接到激光头的锚定机构。 该装置还包括电耦合到激光基座单元的控制器。 控制器响应于用户输入将控制信号发送到激光基座单元。