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    LASER IRRADIATION APPARATUS
    3.
    发明申请
    LASER IRRADIATION APPARATUS 审中-公开

    公开(公告)号：US20180236602A1

    公开(公告)日：2018-08-23

    申请号：US15962664

    申请日：2018-04-25

    Applicant: GIGAPHOTON INC.

    Inventor： Akiyoshi Suzuki ,  Minoru Taniyama ,  Osamu Wakabayashi

    IPC: B23K26/10 ,  G02B26/08

    CPC classification number: B23K26/10 ,  B23K26/00 ,  B23K26/073 ,  G02B26/08 ,  H01L21/20 ,  H01L21/268 ,  H01S3/00 ,  H01S3/10

    Abstract: A laser irradiation apparatus may include: an irradiation head section including first and second irradiation heads each configured to perform laser light irradiation on a workpiece; a laser unit section including first and second laser units configured to respectively output first laser light and second laser light; a beam delivery section provided in an optical path between the laser unit section and the irradiation head section, and configured to perform switching of optical paths between optical paths of the first laser light and the second laser light to cause the first or second laser light to enter the first or second irradiation head; a first beam property varying section provided in an optical path between the first laser unit and the irradiation head section; and a second beam property varying section provided in an optical path between the second laser unit and the irradiation head section.

    LASER IRRADIATION APPARATUS
    4.
    发明申请
    LASER IRRADIATION APPARATUS 审中-公开

    公开(公告)号：US20170252862A1

    公开(公告)日：2017-09-07

    申请号：US15310207

    申请日：2015-07-13

    Applicant: TOYOKOH Co., Ltd.

    Inventor： Kazuaki TOYOSAWA ,  Akihiro KUROYANAGI ,  Kazuhisa FUJITA ,  Shinichiro OKIHARA

    IPC: B23K26/082 ,  B23K26/16

    CPC classification number: B23K26/082 ,  B23K26/0648 ,  B23K26/0652 ,  B23K26/08 ,  B23K26/10 ,  B23K26/14 ,  B23K26/16

    Abstract: This is to provide a laser irradiation apparatus which can drive a deflection optical system (33) with a high speed by a small and lightweight structure and can cope with heat generation of the optical system. The laser irradiation apparatus includes a condensing optical system (32) for condensing a laser beam (B) generated by a laser oscillator (10) at a predetermined focal point (FP), a deflection optical system (33) for deflecting the laser beam (B) generated from the condensing optical system (32) with a predetermined deflection angle, and a driving unit (100) for rotationally driving the deflection optical system (33) around a rotation axis provided substantially in parallel to an optical axis of the condensing optical system (32), wherein the driving unit (100) has an air motor (100) which convert an energy possessed by a gas supplied from a gas supplying source (60) to a rotational force.

    LASER PROCESSING MACHINE AND LASER PROCESSING METHOD
    7.
    发明申请
    LASER PROCESSING MACHINE AND LASER PROCESSING METHOD 审中-公开

    公开(公告)号：US20170080522A1

    公开(公告)日：2017-03-23

    申请号：US15125465

    申请日：2014-12-12

    Applicant: Pansonic Intellectual Property Management Co., Ltd

    Inventor： MANABU NISHIHARA ,  TOSHIICHI MURAKOSHI ,  YOSHINORI SASAKI

    IPC: B23K26/08 ,  B23K37/04

    CPC classification number: B23K26/08 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/10 ,  B23K26/14 ,  B23K37/0408

    Abstract: In conventional machines and methods for laser processing, while the workpiece is being removed from the processing table, the porous sheet interposed between them tends to be torn or displaced. The laser processing machine of the present disclosure includes a processing table having a plurality of first through-holes and a plurality of second through-holes; a first passage; a second passage; a first pump; a second pump, and laser irradiation means. The second through-holes are independent of the first through-holes. The first passage is connected to the first through-holes. The second passage is independent of the first passage and is connected to the second through-holes. The first pump is connected to the first passage and has a sucking function. The second pump is connected to the second passage and has an exhaust function.

    PROCESS AND DEVICE FOR SIMULTANEOUS LASER WELDING
    8.
    发明申请
    PROCESS AND DEVICE FOR SIMULTANEOUS LASER WELDING 审中-公开
    同时激光焊接的工艺和装置

    公开(公告)号：US20170014948A1

    公开(公告)日：2017-01-19

    申请号：US15077234

    申请日：2016-03-22

    Applicant: Shanghai Seeyao Electronics Co., Ltd.

    Inventor： Zhaoji Guo ,  Xiaofen Yang ,  Guoxiang Xin ,  Hai Huang ,  Yonghe Wang

    IPC: B23K26/21 ,  B23K26/10 ,  B23K26/00

    CPC classification number: B23K26/21 ,  B23K26/0006 ,  B23K26/10 ,  B29C65/1612 ,  B29C65/1635 ,  B29C65/1667 ,  B29C65/1677 ,  B29C65/1687 ,  B29C65/7841 ,  B29C66/1122 ,  B29C66/301 ,  B29C66/542 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/8242 ,  B29C66/8322 ,  B29L2031/747 ,  F21S41/29 ,  F21V17/101 ,  B29K2869/00 ,  B29K2909/08

    Abstract: This invention provides a process and device for simultaneous laser welding; after using the moving lower die and the fixing upper die to make the base and the lens attached, by using the light pipe, for example, transparent substances or other cheap materials, to make the laser, which is emitted from the laser source, emit through the lens to a welding region of the base after being processed, to operate rapid and average heating to the welding region; meanwhile, using the welding cylinder to press the base and the lens together, to make base and the lens pressed and welded together in molten state, and when welding, it does not generate powder or other defects, and, at the same time, it can make the height H and the width w of the generated waste selvage between [0, 0.4] mm, which can improve the performance of welding object more efficiently.

    Abstract translation: 本发明提供了用于同时激光焊接的工艺和装置; 在使用移动的下模和固定上模以使基座和透镜附接后，通过使用光管，例如透明物质或其他廉价材料，使从激光源发射的激光发射 经过加工后通过镜头到基座的焊接区域，对焊接区域进行快速平均加热; 同时，使用焊接圆筒将基座和透镜压在一起，使基座和透镜在熔融状态下被压制和焊接在一起，并且在焊接时不会产生粉末或其他缺陷，同时， 可以使产生的废料边缘的高度H和宽度w在[0,0.4] mm之间，可以更有效地提高焊接对象的性能。

    Laser Processor and Hole-opening Processing Method
    9.
    发明申请
    Laser Processor and Hole-opening Processing Method 有权
    激光处理器和开孔处理方法

    公开(公告)号：US20160045984A1

    公开(公告)日：2016-02-18

    申请号：US14783402

    申请日：2014-03-31

    Applicant: MURATA MACHINERY, LTD.

    Inventor： Keita MATSUMOTO

    IPC: B23K26/38 ,  B23K26/08

    CPC classification number: B23K26/38 ,  B23K26/0876 ,  B23K26/10 ,  B23K26/389

    Abstract: A laser processing machine employs a step of forming a pierced hole at a sheet material portion on an inner or outer side of a closed route when a processing to form a hole in the sheet material by cutting along a closed route is carried out. Following this pierced hole a step to perform a cutting process to cut to a predetermined position with a center of the laser beam traversing the closed route and a step of returning, in a condition in which laser irradiation is interrupted, a position of the laser processing head relative to the sheet material to assume a start position lying on the route during a step of cutting to the predetermined position and on the closed route are employed. Thereafter, a step of performing the cutting process from the start position along the closed route is carried out.

    Abstract translation: 激光加工机械采用在封闭路径的内侧或外侧的片材部分形成穿孔的步骤，当通过沿着封闭路径的切割在片材中形成孔时进行加工。 在该穿孔之后，执行切割处理以切割到预定位置的步骤，激光束的中心穿过封闭路线，并且在激光照射被中断的状态下返回激光加工的位置 采用了在切割到预定位置和关闭路线的步骤期间相对于片材的头部，以呈现位于路线上的起始位置。 此后，进行从封闭路径的起始位置进行切断处理的步骤。

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