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公开(公告)号：US20120177380A1
公开(公告)日：2012-07-12
申请号：US13422635
申请日：2012-03-16
IPC分类号： H04B10/14
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a plurality of CMOS chips, a first chip comprising optical and optoelectronic devices and at least a second chip comprising electronic devices may be operable to communicate an optical source signal from a semiconductor laser into the first CMOS chip. The optical source signal may be used to generate first optical signals that may be transmitted from the first CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the first CMOS chip via optical couplers, which may comprise grating couplers.
摘要翻译： 包括多个CMOS芯片的收发器，包括光学和光电子器件的第一芯片和包括电子器件的至少第二芯片可以用于将来自半导体激光器的光源信号传送到第一CMOS芯片。 光源信号可以用于产生可以从第一CMOS芯片传输到光纤的第一光信号。 可以从光纤接收第二光信号，并经由光电检测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面，并且第一光信号可以从CMOS芯片的顶表面传出。 可以通过可以包括光栅耦合器的光耦合器从第一CMOS芯片传送第一光信号。
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公开(公告)号：US20120177378A1
公开(公告)日：2012-07-12
申请号：US13422695
申请日：2012-03-16
IPC分类号： H04B10/14
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a CMOS chip and a plurality of semiconductor lasers coupled with the CMOS chip may be operable to communicate optical source signals from the plurality of semiconductor lasers into the CMOS chip. The source signals may be used to generate first optical signals that may be transmitted from the CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals for use by the CMOS chip. The optical source signals may be communicated from the semiconductor lasers into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.
摘要翻译： 包括CMOS芯片和与CMOS芯片耦合的多个半导体激光器的收发器可以用于将来自多个半导体激光器的光源信号传送到CMOS芯片。 源信号可以用于产生可以从CMOS芯片传输到光纤的第一光信号。 可以从光纤接收第二光信号并将其转换为电信号供CMOS芯片使用。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面，并且第一光信号可以从CMOS芯片的顶表面传出。 可以通过可以包括光栅耦合器的光耦合器从CMOS芯片传送第一光信号。
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公开(公告)号：US20100046955A1
公开(公告)日：2010-02-25
申请号：US12483699
申请日：2009-06-12
IPC分类号： H04B10/00
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： Systems and methods for configuring an integrated transceiver are disclosed. In one embodiment, very small form factor transceivers can be configured to allow 10G optical interconnects over distances up to 2k km. Transceiver circuitry can be integrated on a single die, and be electrically connected to a transmitter such as a laser-diode and a receiver such as a photo-diode. In one embodiment, the laser and photo diodes can be edge-operating, and be mounted on the die. In one embodiment, one or both of the diodes can be surface-operating so as to allow relaxation of alignment requirement. In one embodiment, one or both of the diodes can be mounted to a submount that is separate from the die so as to facilitate separate assembly and testing. In one embodiment, the diodes can be optically coupled to a ferrule via an optical coupling element so as to manage loss in certain situations.
摘要翻译： 公开了用于配置集成收发器的系统和方法。 在一个实施例中，非常小的形状因数收发器可被配置为允许距离高达2k公里的10G光学互连。 收发器电路可以集成在单个管芯上，并且电连接到诸如激光二极管的发射器和诸如光电二极管的接收器。 在一个实施例中，激光器和光电二极管可以是边缘操作的，并且被安装在管芯上。 在一个实施例中，一个或两个二极管可以是表面操作的，以便允许放宽对准要求。 在一个实施例中，一个或两个二极管可以安装到与模具分开的子安装座，以便于单独的组装和测试。 在一个实施例中，二极管可以经由光耦合元件光学耦合到套圈，以便在某些情况下管理损耗。
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公开(公告)号：US08121447B2
公开(公告)日：2012-02-21
申请号：US13156894
申请日：2011-06-09
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a plurality of CMOS chips may be operable to communicate an optical source signal from a semiconductor laser into a first CMOS chip via optical couplers. The optical source signal may be used to generate first optical signals that are transmitted from the first CMOS chip to optical fibers coupled to the first CMOS chip via one or more optical couplers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the first CMOS chip. The optical source signal may be communicated from the semiconductor laser into the first CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the first CMOS chip. The electrical signals may be communicated to at least a second of the plurality of CMOS chips comprising electronic devices.
摘要翻译： 包括多个CMOS芯片的收发器可以用于通过光耦合器将来自半导体激光器的光源信号传送到第一CMOS芯片。 光源信号可以用于产生经由一个或多个光耦合器从第一CMOS芯片传输到耦合到第一CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由第一CMOS芯片中的光电探测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到第一CMOS芯片到顶表面，并且第一光信号可以从第一CMOS芯片的顶表面传出。 电信号可以传送到包括电子设备的多个CMOS芯片中的至少一个。
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公开(公告)号：US20110236029A1
公开(公告)日：2011-09-29
申请号：US13156979
申请日：2011-06-09
IPC分类号： H04B10/12
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.
摘要翻译： 包括CMOS芯片和耦合到芯片的激光器的收发器可以用于将来自半导体激光器的光源信号传送到CMOS芯片。 光源信号可以用于产生从CMOS芯片发送到耦合到CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由CMOS芯片中的光电检测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面，并且第一光信号可以从CMOS芯片的顶表面传出。 光源信号可以被传送到CMOS芯片，并且可以通过可以包括光栅耦合器的光耦合器从CMOS芯片传送第一光信号。
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公开(公告)号：US07961992B2
公开(公告)日：2011-06-14
申请号：US12483699
申请日：2009-06-12
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via a semiconductor laser and one or more photodetectors. The optical and optoelectronic devices may include waveguides, modulators, multiplexers, switches, and couplers. The photodetector may be integrated in the CMOS chip. The photodetector and the semiconductor laser may be mounted on the CMOS chip. The optical signals may be communicated out of and in to a top surface of the CMOS chip. A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry, may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via grating couplers. The optical signals may be communicated out of and in to a top surface of the CMOS chip.
摘要翻译： 包括光学和光电子器件的CMOS芯片上的收发器和电子电路可以用于在CMOS芯片和经由半导体激光器和一个或多个光电探测器耦合到CMOS芯片的光纤之间传送光信号。 光学和光电器件可以包括波导，调制器，多路复用器，开关和耦合器。 光电检测器可以集成在CMOS芯片中。 光检测器和半导体激光器可以安装在CMOS芯片上。 光信号可以在CMOS芯片的顶表面之外传送出去。 包括光学和光电子器件以及电子电路的CMOS芯片上的收发器可以用于在CMOS芯片和通过光栅耦合器耦合到CMOS芯片的光纤之间传送光信号。 光信号可以在CMOS芯片的顶表面之外传送出去。
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公开(公告)号：US09136946B2
公开(公告)日：2015-09-15
申请号：US13422635
申请日：2012-03-16
申请人： Peter De Dobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
发明人： Peter De Dobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a plurality of CMOS chips, a first chip comprising optical and optoelectronic devices and at least a second chip comprising electronic devices may be operable to communicate an optical source signal from a semiconductor laser into the first CMOS chip. The optical source signal may be used to generate first optical signals that may be transmitted from the first CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the first CMOS chip via optical couplers, which may comprise grating couplers.
摘要翻译： 包括多个CMOS芯片的收发器，包括光学和光电子器件的第一芯片以及包括电子器件的至少第二芯片可以用于将来自半导体激光器的光源信号传送到第一CMOS芯片。 光源信号可以用于产生可以从第一CMOS芯片传输到光纤的第一光信号。 可以从光纤接收第二光信号，并经由光电检测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面，并且第一光信号可以从CMOS芯片的顶表面传出。 可以通过可以包括光栅耦合器的光耦合器从第一CMOS芯片传送第一光信号。
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公开(公告)号：US08577191B2
公开(公告)日：2013-11-05
申请号：US13422695
申请日：2012-03-16
申请人： Peter De Dobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
发明人： Peter De Dobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a CMOS chip and a plurality of semiconductor lasers coupled with the CMOS chip may be operable to communicate optical source signals from the plurality of semiconductor lasers into the CMOS chip. The source signals may be used to generate first optical signals that may be transmitted from the CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals for use by the CMOS chip. The optical source signals may be communicated from the semiconductor lasers into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.
摘要翻译： 包括CMOS芯片和与CMOS芯片耦合的多个半导体激光器的收发器可以用于将来自多个半导体激光器的光源信号传送到CMOS芯片。 源信号可以用于产生可以从CMOS芯片传输到光纤的第一光信号。 可以从光纤接收第二光信号并将其转换为电信号供CMOS芯片使用。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面，并且第一光信号可以从CMOS芯片的顶表面传出。 可以通过可以包括光栅耦合器的光耦合器从CMOS芯片传送第一光信号。
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公开(公告)号：US08165431B2
公开(公告)日：2012-04-24
申请号：US13156979
申请日：2011-06-09
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.
摘要翻译： 包括CMOS芯片和耦合到芯片的激光器的收发器可以用于将来自半导体激光器的光源信号传送到CMOS芯片。 光源信号可以用于产生从CMOS芯片发送到耦合到CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由CMOS芯片中的光电检测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面，并且第一光信号可以从CMOS芯片的顶表面传出。 光源信号可以被传送到CMOS芯片，并且可以通过可以包括光栅耦合器的光耦合器从CMOS芯片传送第一光信号。
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公开(公告)号：US20110243569A1
公开(公告)日：2011-10-06
申请号：US13156894
申请日：2011-06-09
IPC分类号： H04B10/12
CPC分类号： H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
摘要： A transceiver comprising a plurality of CMOS chips may be operable to communicate an optical source signal from a semiconductor laser into a first CMOS chip via optical couplers. The optical source signal may be used to generate first optical signals that are transmitted from the first CMOS chip to optical fibers coupled to the first CMOS chip via one or more optical couplers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the first CMOS chip. The optical source signal may be communicated from the semiconductor laser into the first CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the first CMOS chip. The electrical signals may be communicated to at least a second of the plurality of CMOS chips comprising electronic devices.
摘要翻译： 包括多个CMOS芯片的收发器可以用于通过光耦合器将来自半导体激光器的光源信号传送到第一CMOS芯片。 光源信号可以用于产生经由一个或多个光耦合器从第一CMOS芯片传输到耦合到第一CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由第一CMOS芯片中的光电探测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到第一CMOS芯片到顶表面，并且第一光信号可以从第一CMOS芯片的顶表面传出。 电信号可以传送到包括电子设备的多个CMOS芯片中的至少一个。
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