公开(公告)号：US20090071933A1

公开(公告)日：2009-03-19

申请号：US12210026

申请日：2008-09-12

申请人： Philip Floyd ,  Evgeni Gousev ,  David Heald ,  Ben Ward Hertzler ,  Chok Ho ,  Teruo Sasagawa ,  Xiaoming Yan ,  Todd Lyle Zion

发明人： Philip Floyd ,  Evgeni Gousev ,  David Heald ,  Ben Ward Hertzler ,  Chok Ho ,  Teruo Sasagawa ,  Xiaoming Yan ,  Todd Lyle Zion

IPC分类号： B44C1/22 ,  C23F1/08

CPC分类号： H01L21/32135 ,  B01D53/002 ,  B01D2257/11 ,  B01D2257/2027 ,  H01L21/31116

摘要： The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process.

摘要翻译： 可以以各种方式增加蚀刻工艺的效率，并且可以降低蚀刻工艺的成本。 未蚀刻的蚀刻剂可以在蚀刻过程中被隔离并再循环。 蚀刻副产物可以在蚀刻过程中从蚀刻系统中收集和去除。 蚀刻剂的组分可以被分离并用于一般的另外的蚀刻剂。 蚀刻剂或被蚀刻的层中的任一个或两者也可以针对特定的蚀刻工艺进行优化。