公开(公告)号：US20230221174A1

公开(公告)日：2023-07-13

申请号：US17571554

申请日：2022-01-10

Applicant: PixArt Imaging Inc.

Inventor： Sai Mun LEE ,  Chee Pin T'NG

IPC: G01J1/04 ,  H05K1/18

CPC classification number: G01J1/0407 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10719

Abstract: The invention provides an optical sensor package. The optical sensor package includes: a printed circuit board (PCB); a sensor disposed on the PCB; a glass cover disposed directly on the sensor; and an aperture disposed on the PCB comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The cut-out section of the ceiling is smaller in area than the glass cover. The part of the aperture ceiling which overhangs the glass cover is thicker than the remaining part. The optical sensor package further includes an LED die disposed on the PCB, and Kapton tape placed over the ceiling of the aperture.