公开(公告)号：US11863087B2

公开(公告)日：2024-01-02

申请号：US17574534

申请日：2022-01-12

Applicant: PixArt Imaging Inc.

Inventor： Ville Topias Makinen ,  Roberto Tejera-Garcia ,  Daniil Zykov

IPC: H02N1/00

CPC classification number: H02N1/006

Abstract: A stacked structure is composed of a plurality of layers, and includes: a substrate; a plurality of conductive patterns printed on the substrate; and at least one layer of elastic nodules formed between two layers of the plurality of layers, the layer of elastic nodules including a sensing area being used for at least one of actuation or sensing. The stacked structure is formed by folding the substrate multiple times. The stacked structure further includes: an adhesive layer printed on but not completely covering the conductive patterns and substrate, and forming at least one air reservoir for holding air displaced when the sensing area is compressed. The stacked structure does not include electrically conducting through holes or electrically connecting structures.

公开(公告)号：US20220181994A1

公开(公告)日：2022-06-09

申请号：US17574534

申请日：2022-01-12

Applicant: PixArt Imaging Inc.

Inventor： Ville Topias Makinen ,  Roberto Tejera-Garcia ,  Daniil Zykov

IPC: H02N1/00

Abstract: A stacked structure is composed of a plurality of layers, and includes: a substrate; a plurality of conductive patterns printed on the substrate; and at least one layer of elastic nodules formed between two layers of the plurality of layers, the layer of elastic nodules including a sensing area being used for at least one of actuation or sensing. The stacked structure is formed by folding the substrate multiple times. The stacked structure further includes: an adhesive layer printed on but not completely covering the conductive patterns and substrate, and forming at least one air reservoir for holding air displaced when the sensing area is compressed. The stacked structure does not include electrically conducting through holes or electrically connecting structures.