公开(公告)号：US09627286B1

公开(公告)日：2017-04-18

申请号：US15203068

申请日：2016-07-06

Applicant: PixArt Imaging Incorporation

Inventor： Kuo-Hsiung Li ,  Chi-Chih Shen ,  Jui-Cheng Chuang ,  Jen-Yu Chen

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/16 ,  H01L23/055

CPC classification number: H01L23/16 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10

Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.

公开(公告)号：US20170133290A1

公开(公告)日：2017-05-11

申请号：US15203068

申请日：2016-07-06

Applicant: PixArt Imaging Incorporation

Inventor： Kuo-Hsiung Li ,  Chi-Chih Shen ,  Jui-Cheng Chuang ,  Jen-Yu Chen

IPC: H01L23/16 ,  H01L23/055

CPC classification number: H01L23/16 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10

Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.