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公开(公告)号:US20210229370A1
公开(公告)日:2021-07-29
申请号:US15734801
申请日:2019-06-03
摘要: A process for gluing on an industrial scale, preferably by using hot-melt adhesives, substrates, preferably made of plastic material, by nano-modifying the adhesives through the addition of particles sensitive to electromagnetic fields and electromagnetic induction coupling. The present invention also relates to a simple, low-cost and environment-friendly (i.e., eco-compatible) separation of various components glued by way of the adhesives through the use of the same equipment and the same type of process. Furthermore, the present invention also relates to repairing glued junctions made by way of the adhesives.