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公开(公告)号:US20180154619A1
公开(公告)日:2018-06-07
申请号:US15570001
申请日:2016-05-10
Applicant: Polyplastics Co., Ltd.
Inventor: Hidetoshi OKAWA
IPC: B32B27/32 , B32B15/085 , B32B7/12 , B65D65/40
CPC classification number: B32B27/32 , B32B1/02 , B32B7/12 , B32B15/085 , B32B15/09 , B32B27/08 , B32B27/325 , B32B27/36 , B32B2307/51 , B32B2307/518 , B32B2307/58 , B32B2367/00 , B32B2439/46 , B32B2439/70 , B32B2439/80 , B65D65/40
Abstract: A low-adsorptivity packaging bag equipped with a sealant layer that satisfies all of the following: heat-sealability, low adsorptivity, cuttability, and water-vapor barrier properties. A low-adsorptivity packaging bag for storing contents containing a low-molecular-weight volatile compound, in which a layered body provided with a substrate layer including one or more layers and a sealant layer containing a cyclic olefin resin having a glass transition temperature of 50-190° C., inclusive, is formed as a result of heat-sealing with the sealant layer side as the inside surface thereof.
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公开(公告)号:US20180105964A1
公开(公告)日:2018-04-19
申请号:US15567710
申请日:2016-05-10
Applicant: Polyplastics Co., Ltd.
Inventor: Hidetoshi OKAWA
IPC: D04H1/4291 , D04H3/16 , D01F6/30 , A61K47/32 , A61K9/70
CPC classification number: D04H1/4291 , A61K9/70 , A61K47/32 , D01F6/30 , D04H1/544 , D04H3/16 , D10B2321/02 , D10B2401/041 , D10B2509/00 , D21H13/12 , D21H15/10
Abstract: A non-woven fabric that absorbs only a small amount of volatile low molecular weight compound, and that has good texture when used as a non-woven fabric that makes contact with human skin. This thermal bond non-woven fabric containing cyclic olefin resin includes at least: fibers (A) containing at least 50 mass % of a cyclic olefin resin (A1) having a glass transition temperature TgA1° C.; and fibers (B) containing at least 10 mass % of either a cyclic olefin resin (B1) having a glass transition temperature TgB1° C., or a crystalline thermoplastic resin (B2) having a melting point MpB2° C.; the fibers (A) and the fibers (B) being heat-spliced together; wherein TgA1>TgB1 or TgA1>MpB2, and either the difference between the glass transition temperature TgA1° C. and the glass transition temperature TgB1° C. or the difference between the glass transition temperature TgA1° C. and the melting point MpB2° C. exceeds 20° C.
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