公开(公告)号：US20210289659A2

公开(公告)日：2021-09-16

申请号：US16859202

申请日：2020-04-27

申请人： Prabhakar SUBRAHMANYAM ,  Casey WINKEL ,  Yingqiong BU ,  Ming ZHANG ,  Yuehong FAN ,  Yi XIA ,  Ying-Feng PANG

发明人： Prabhakar SUBRAHMANYAM ,  Casey WINKEL ,  Yingqiong BU ,  Ming ZHANG ,  Yuehong FAN ,  Yi XIA ,  Ying-Feng PANG

IPC分类号： H05K7/20

摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.