公开(公告)号：US06817442B2

公开(公告)日：2004-11-16

申请号：US10112629

申请日：2002-03-29

申请人： Donovan Van Sleet ,  Robin A. Steinbrecher ,  Casey Winkel

发明人： Donovan Van Sleet ,  Robin A. Steinbrecher ,  Casey Winkel

IPC分类号： E04B182

CPC分类号： H05K7/20172

摘要： A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.

摘要翻译： 由形成底盘外部的一部分的材料构成的底盘的一部分和邻近底盘部分的内表面的高密度柔性材料，其中空气孔通过底盘部分和高部分相连接地形成 密度柔软材料。

公开(公告)号：US20240357777A1

公开(公告)日：2024-10-24

申请号：US18757049

申请日：2024-06-27

申请人： Berhanu Kebede Wondimu ,  Casey Winkel ,  Sandeep Ahuja ,  Mark Angus MacDonald ,  Benson Dale Inkley ,  Mark Joseph Luckeroth ,  Jason Crop ,  Srinivasa Rao Damaraju ,  Casey Jamesen Carte ,  Laxmi Vishwanathan ,  Timothy Yee-Kwong Kam ,  Olaotan Frank Elenitoba-Johnson ,  Romir Desai ,  Kevin Mistofsky ,  Zhikui Ren

发明人： Berhanu Kebede Wondimu ,  Casey Winkel ,  Sandeep Ahuja ,  Mark Angus MacDonald ,  Benson Dale Inkley ,  Mark Joseph Luckeroth ,  Jason Crop ,  Srinivasa Rao Damaraju ,  Casey Jamesen Carte ,  Laxmi Vishwanathan ,  Timothy Yee-Kwong Kam ,  Olaotan Frank Elenitoba-Johnson ,  Romir Desai ,  Kevin Mistofsky ,  Zhikui Ren

IPC分类号： H05K7/20 ,  G06F1/20 ,  H05K7/14

CPC分类号： H05K7/20836 ,  G06F1/206 ,  H05K7/1488 ,  H05K7/20781

摘要： Methods and apparatus for localized temperature control and leakage protection in a server housing are disclosed. An example system includes interface circuitry, machine readable instructions, and at least one programmable circuit of a server disposable inside a portion of a server housing. The at least one programmable circuit are to at least one of instantiate or execute the machine readable instructions to identify a temperature of the server, determine a target temperature for a workload for the server, and control an actuator based on the temperature and the target temperature, the actuator to control a local flow rate of a coolant in the portion of the server housing.

公开(公告)号：US20210289659A2

公开(公告)日：2021-09-16

申请号：US16859202

申请日：2020-04-27

申请人： Prabhakar SUBRAHMANYAM ,  Casey WINKEL ,  Yingqiong BU ,  Ming ZHANG ,  Yuehong FAN ,  Yi XIA ,  Ying-Feng PANG

发明人： Prabhakar SUBRAHMANYAM ,  Casey WINKEL ,  Yingqiong BU ,  Ming ZHANG ,  Yuehong FAN ,  Yi XIA ,  Ying-Feng PANG

IPC分类号： H05K7/20

摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.