公开(公告)号：US20040090733A1

公开(公告)日：2004-05-13

申请号：US10694125

申请日：2003-10-27

Applicant: Presidio Components, Inc.

Inventor： Alan Devoe ,  Lambert Devoe ,  Hung Trinh

IPC: H01G004/12 ,  H01G004/228 ,  H01L021/02

CPC classification number: H01G4/005 ,  H01G4/06 ,  H01G4/228 ,  H01G4/33

Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance that may be easily and inexpensively manufactured. To this end, sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may comprise an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Alternatively, the composite material may comprise an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, and the coated composite is mounted to the pc board and the coating provides an electrical connection to an internal electrode. By the present invention, vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract translation: 具有高结构强度和电容的单片或基本单片单层电容器，其可以容易且廉价地制造。 为此，将生坯状陶瓷电介质材料和陶瓷/金属复合材料片层压在一起，切割成单个芯片，并烧结以将陶瓷烧结在一起。 复合材料可以包括足以使复合材料导电的量的金属，由此复合材料可用于一个或两个电极，并将电容器安装到印刷电路板上。 或者，复合材料可以包括不足以使复合材料导电但足以用作电镀工艺的种子点的金属量，其中复合材料优选地涂覆有导电金属，并且涂覆的复合材料安装到印刷电路板和 涂层提供与内部电极的电连接。 通过本发明，提供了垂直取向的表面安装电容器和混合电容器。