公开(公告)号：US20040264103A1

公开(公告)日：2004-12-30

申请号：US10870037

申请日：2004-06-18

申请人： NGK SPARK PLUG CO., LTD.

发明人： Jun Otsuka ,  Manabu Sato

IPC分类号： H01G004/228

CPC分类号： H01L23/49822 ,  H01G2/065 ,  H01G4/232 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/162 ,  H01L2224/05599

摘要： A capacitor comprising: a thin film laminate including a plurality of dielectric thin films and a plurality of electrode conductor thin films laminated alternately; and first kind terminals and second kind terminals formed over a first main surface of said thin film laminate and isolated from each other in a DC current, wherein a first kind electrode conductor thin films electrically connecting with said first kind terminals and a second kind electrode conductor thin films electrically connecting with said second kind terminals are so alternately laminated in a laminate direction as are separated by said dielectric thin films, and a first dielectric thin film, an other kind electrode conductor thin film and a second dielectric thin film are laminated in this order between one same kind electrode conductor thin film and other same kind electrode conductor thin film adjoining in said laminate direction, and first through holes, second through holes and the like are defined herein.

公开(公告)号：US20040257748A1

公开(公告)日：2004-12-23

申请号：US10818951

申请日：2004-04-06

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Robert Heistand II ,  John L. Galvagni ,  Sriram Dattaguru ,  Jeffrey A. Horn ,  Richard A. Ladew

IPC分类号： H01G004/228

CPC分类号： H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01L2924/01029 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

摘要： A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material for enhanced durability, and external lands may be thicker than internal conductive elements and/or may also be embedded in top and/or bottom component surfaces. A variety of potential internal electrode configurations are possible including ones configured for orientation-insensitive component mounting and for high density peripheral termination interdigitated capacitors.

摘要翻译： 多层电子部件包括与多个内部电极元件和多个内部固定突片交错的多个电介质层。 内部电极元件和锚定片的部分沿着电子元件的外围在一个或多个对齐的列中露出。 每个暴露部分在与给定列中的其它暴露部分预定距离内，使得桥接端接可以通过在选定的分别对准的柱上沉积一个或多个电镀终止材料而形成。 可以提供内部锚定突片并以与其它暴露的导电部分的预定关系暴露，以帮助沿着装置的周边使金属化电镀材料成核。 可以提供外部锚定片或平台以形成延伸到装置的顶部和/或底部表面的终端。 选择的导电元件可以由有限体积百分比的陶瓷材料形成，以增强耐久性，并且外部焊盘可以比内部导电元件厚，和/或也可以嵌入在顶部和/或底部部件表面中。 各种潜在的内部电极配置是可能的，包括被配置用于定向不敏感元件安装和用于高密度外围端接叉指电容器的构造。

公开(公告)号：US20040233610A1

公开(公告)日：2004-11-25

申请号：US10442509

申请日：2003-05-20

发明人： Cem Basceri ,  Thomas M. Graettinger

IPC分类号： H01G004/228

CPC分类号： H01L28/40 ,  H01G4/1209 ,  H01G4/228 ,  H01G4/33 ,  H01L21/31637 ,  H01L21/31641 ,  H01L21/31645 ,  H01L21/31691 ,  H01L23/5223 ,  H01L27/10852 ,  H01L27/11502 ,  H01L28/56 ,  H01L28/75 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention includes capacitor constructions comprising a layer of aluminum oxide between a high-k dielectric material and a layer comprising titanium and nitrogen. The layer comprising titanium and nitrogen can be, for example, titanium nitride and/or boron-doped titanium nitride. The capacitor constructions can be incorporated into DRAM cells, which in turn can be incorporated into electronic systems. The invention also includes methods of forming capacitor constructions.

摘要翻译： 本发明包括在高k介电材料和包含钛和氮的层之间包含一层氧化铝的电容器结构。 包含钛和氮的层可以是例如氮化钛和/或硼掺杂的氮化钛。 电容器结构可以并入到DRAM单元中，这又可以并入到电子系统中。 本发明还包括形成电容器结构的方法。

公开(公告)号：US20040218343A1

公开(公告)日：2004-11-04

申请号：US10782602

申请日：2004-02-19

发明人： Hiroyuki Tamura

IPC分类号： H01G004/228

CPC分类号： H01G9/012 ,  H01G9/10

摘要： To provide a capacitor device that can be made lighter in weight, thin shaped, and miniaturized, which is comprised of a plurality of conductive pattern electrodes 18 and 22 electrically separated by a separation groove 19; a capacitor element 15 including an anode lead 16 fixed to the one conductive pattern electrode 18 and a cathode lead 17 fixed to the other conductive pattern electrode 22; an insulating resin 24 for covering the capacitor element 15 and a part working as the conductive pattern electrodes 18 and 22 except for a lower face of the conductive pattern electrodes 18 and 22, and for integrally supporting the conductive pattern electrode and the capacitor element.

摘要翻译： 提供一种电容器装置，其可以由重量轻，薄型化和小型化的电容器器件组成，其由通过分隔槽19电隔离的多个导电图案电极18和22组成; 电容器元件15，其包括固定到一个导电图案电极18的阳极引线16和固定到另一导电图案电极22的阴极引线17; 用于覆盖电容器元件15的绝缘树脂24和除了导电图案电极18和22的下表面之外的导电图案电极18和22的部分，并且用于一体地支撑导电图案电极和电容器元件。

公开(公告)号：US20040218342A1

公开(公告)日：2004-11-04

申请号：US10427230

申请日：2003-04-30

申请人： Industrial Technology Research Institute

发明人： Wei-Ming Jow ,  Pei-Shen Wei ,  Ching-Liang Weng ,  Chun-Kun Wu ,  Chang-Sheng Chen

IPC分类号： H01G004/228

CPC分类号： H01G4/232 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/09672 ,  H05K2201/09718

摘要： An embedded microelectronic capacitor equipped with geometrically-centered electrodes which includes an upper electrode plate of a first polarity; a middle electrode plate of a second polarity opposite to the first polarity; at least one lower electrode plate of the first polarity in electrical communication with the upper electrode plate through a center via. The center via is positioned at a distance from a geometric center of the middle electrode plate of not larger than 50% of the diameter of the plate, and preferably not larger than 30% of the diameter.

摘要翻译： 一种配备有几何中心电极的嵌入式微电子电容器，其包括第一极性的上电极板; 与第一极性相反的第二极性的中间电极板; 至少一个第一极性的下电极板通过中心通孔与上电极板电连通。 中心通孔位于中间电极板的几何中心一定距离处，不超过板的直径的50％，优选不大于直径的30％。

公开(公告)号：US20040184218A1

公开(公告)日：2004-09-23

申请号：US10764519

申请日：2004-01-27

申请人： Fujitsu Limited

发明人： Wensheng Wang ,  Mitsushi Fujiki ,  Ko Nakamura

IPC分类号： H01G004/228

CPC分类号： H01L28/75 ,  H01L27/10814 ,  H01L28/55

摘要： There is provided the capacitor which has the lower electrode having a structure in which the first conductive layer containing a first metal, the second conductive layer that is formed on the first conductive layer and made of the metal oxide of the second metal different from the first metal, and the third conductive layer that is formed on the second conductive layer and made of the third metal different from the first metal are formed sequentially; the dielectric layer formed on the lower electrode; and the upper electrode formed on the capacitor dielectric layer.

公开(公告)号：US20040179326A1

公开(公告)日：2004-09-16

申请号：US10794065

申请日：2004-03-08

发明人： Koji Hattori

IPC分类号： H01G004/228

CPC分类号： H01G4/30 ,  H01G4/008 ,  H01G4/1227

摘要： A monolithic ceramic capacitor includes a plurality of stacked ceramic dielectric layers, thin internal conductors that are each placed between the ceramic dielectric layers and arranged in parallel, and external conductors each electrically connected to ends of the corresponding internal conductors. The ceramic dielectric layers have a thickness of about 0.5 nullm to less than about 1.5 nullm. The internal conductors have a thickness of about 0.1 nullm to about 0.4 nullm. The internal conductors each have spaces therein and the total area percentage of the spaces in each internal conductor is more than about 10% to less than about 40% of the area of the internal conductor. The ceramic dielectric layers contain a sintering additive containing Si, and the sintering additive is placed in the spaces in a segregated manner.

摘要翻译： 单片陶瓷电容器包括多个堆叠的陶瓷电介质层，薄的内部导体，各自放置在陶瓷介电层之间并且平行布置，以及外部导体，每个电导体连接到相应的内部导体的端部。 陶瓷电介质层的厚度为约0.5μm至小于约1.5μm。 内部导体具有约0.1μm至约0.4μm的厚度。 内部导体各自具有空间，并且每个内部导体中的空间的总面积百分比大于内部导体的面积的约10％至小于约40％。 陶瓷电介质层含有含Si的烧结添加剂，烧结添加剂以分离的方式放置在空间中。

公开(公告)号：US20040174656A1

公开(公告)日：2004-09-09

申请号：US10674906

申请日：2003-09-30

申请人： AVX Corporation

发明人： Jason MacNeal ,  John L. Galvagni ,  Andrew P. Ritter

IPC分类号： H01G004/228

CPC分类号： H01G4/232 ,  H01G4/30

摘要： A window via capacitor comprises a stacked multilayer configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. Each first and second layer is preferably characterized by a sheet of dielectric material with a respective first or second electrode plate provided thereon. Adjacent first and second electrode plates form opposing active capacitor plates in the multilayer configuration. Portions of each first and second electrode plate extend to and are exposed on selected periphery side portions. Electrode portions of each transition layer are aligned in respective similar locations to the first and second electrode plates such that peripheral terminations can connect selected electrode portions of a first polarity together and selected portions of the opposing polarity together. Solder balls may also be applied to window vias to yield a capacitor compatible with BGA mounting technology.

摘要翻译： 窗口通孔电容器包括至少一个底层，多个第一和第二层，过渡层和覆盖层的堆叠多层结构。 每个第一层和第二层的特征在于一层电介质材料，其上设有相应的第一或第二电极板。 相邻的第一和第二电极板在多层结构中形成相对的有源电容器板。 每个第一和第二电极板的部分延伸到并且在选定的外围侧部分上露出。 每个过渡层的电极部分在与第一和第二电极板的各自相似的位置中对准，使得外围终端可以将选定的第一极性的电极部分连接在一起并将相对极性的选定部分连接在一起。 焊球也可以应用于窗口通孔，以产生与BGA安装技术兼容的电容器。

公开(公告)号：US20040165335A1

公开(公告)日：2004-08-26

申请号：US10784773

申请日：2004-02-24

申请人： FUJITSU LIMITED

发明人： Shuji Nakamura

IPC分类号： H01G004/228

CPC分类号： H01L28/60 ,  H01L21/76895

摘要： A capacitor 19 comprises a lower electrode 14 formed on a substrate 10, an upper electrode 18 opposed to the lower electrode, and a capacitor dielectric film 16 formed between the lower electrode and the upper electrode, in which at least one of the lower electrode and the upper electrodes is an electrode of a metal substituted layer. The lower electrodes of polysilicon are formed, and then after the high-temperature heat processing for improving film quality of the capacitor dielectric film has been performed, the lower electrodes of polysilicon is substituted with aluminum to form the lower electrodes of aluminum, whereby aluminum, which cannot withstand the heat processing for improving film quality of the capacitor dielectric film can be used as a material of the lower electrodes. Thus, capacitors having good high-speed response can be formed.

摘要翻译： 电容器19包括形成在基板10上的下电极14，与下电极相对的上电极18和形成在下电极和上电极之间的电容器电介质膜16，其中下电极和 上部电极是金属取代层的电极。 形成多晶硅的下部电极，然后在进行用于提高电容器电介质膜的膜质量的高温热处理之后，用铝代替多晶硅的下部电极，形成铝的下部电极，由此铝， 不能承受用于提高电容器电介质膜的膜质量的热处理可以用作下电极的材料。 因此，可以形成具有良好高速响应的电容器。

公开(公告)号：US20040090733A1

公开(公告)日：2004-05-13

申请号：US10694125

申请日：2003-10-27

申请人： Presidio Components, Inc.

发明人： Alan Devoe ,  Lambert Devoe ,  Hung Trinh

IPC分类号： H01G004/12 ,  H01G004/228 ,  H01L021/02

CPC分类号： H01G4/005 ,  H01G4/06 ,  H01G4/228 ,  H01G4/33

摘要： A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance that may be easily and inexpensively manufactured. To this end, sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may comprise an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Alternatively, the composite material may comprise an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, and the coated composite is mounted to the pc board and the coating provides an electrical connection to an internal electrode. By the present invention, vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

摘要翻译： 具有高结构强度和电容的单片或基本单片单层电容器，其可以容易且廉价地制造。 为此，将生坯状陶瓷电介质材料和陶瓷/金属复合材料片层压在一起，切割成单个芯片，并烧结以将陶瓷烧结在一起。 复合材料可以包括足以使复合材料导电的量的金属，由此复合材料可用于一个或两个电极，并将电容器安装到印刷电路板上。 或者，复合材料可以包括不足以使复合材料导电但足以用作电镀工艺的种子点的金属量，其中复合材料优选地涂覆有导电金属，并且涂覆的复合材料安装到印刷电路板和 涂层提供与内部电极的电连接。 通过本发明，提供了垂直取向的表面安装电容器和混合电容器。