公开(公告)号：US20030022486A1

公开(公告)日：2003-01-30

申请号：US10097052

申请日：2002-03-13

申请人： ProMOS Technologies Inc.

发明人： Joseph Wu

IPC分类号： H01L021/44 ,  H01L021/4763

CPC分类号： H01L21/76804 ,  H01L21/76877

摘要： The present invention provides a method to prevent short of contact and metal lines. The method is applied in a substrate formed with a number of contact windows. The method is comprised of: (a) forming a first conductive layer in the contact windows without filling up the contact windows; (b) forming liners in the contact windows to reduce the openings of the contact windows; (c) forming liner trenches in the contact windows; and (d) forming a second conduction layer on top of the first conductive layer in the contact windows. According to this invention, shorts between contact windows and metal lines is effectively prevented. Therefore, the product yield is greatly improved.

摘要翻译： 本发明提供一种防止接触不良和金属线的方法。 该方法应用于形成有多个接触窗口的基板中。 该方法包括：（a）在接触窗口中形成第一导电层而不填充接触窗口; （b）在接触窗中形成衬垫以减少接触窗的开口; （c）在接触窗中形成衬垫槽; 和（d）在接触窗口中的第一导电层的顶部上形成第二导电层。 根据本发明，有效地防止了接触窗和金属线之间的短路。 因此，产品产量大大提高。