公开(公告)号：US11553602B2

公开(公告)日：2023-01-10

申请号：US17354478

申请日：2021-06-22

申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD ,  Avary Holding (Shenzhen) Co., Limited. ,  GARUDA TECHNOLOGY CO., LTD.

发明人： Yin-Ju Chen ,  Jing-Cyuan Yang ,  Yen-Chang Chu

IPC分类号： H05K3/46 ,  H05K3/38 ,  H05K1/02 ,  B82Y40/00

摘要： A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.