公开(公告)号：US20250007624A1

公开(公告)日：2025-01-02

申请号：US18611179

申请日：2024-03-20

Applicant: QUALCOMM INCORPORATED

Inventor： Yunfei FENG ,  Li LIU ,  Chuan WANG ,  Vahid DABBAGH REZAEI ,  Vinod PANIKKATH ,  Alaaeldien Mohamed Abdelrazek MEDRA ,  Anosh DAVIERWALLA ,  Xinmin YU ,  Muhammad HASSAN ,  Wu-Hsin CHEN ,  Sherif Hassan Kamel EMBABI

IPC: H04B17/00 ,  H03F3/195 ,  H04B1/04 ,  H04B1/40

Abstract: A method of self-testing a transceiver integrated circuit substrate includes: providing a test signal to a transmission line that is communicatively coupled, or selectively communicatively coupled, to an input of a power amplifier of a first transceiver subcircuit of the transceiver integrated circuit substrate; providing the test signal from the transmission line to an LNA of an LNA of a second transceiver subcircuit of the transceiver integrated circuit substrate; and measuring the test signal before amplification by the LNA, or after amplification by the LNA, or both.