公开(公告)号：US20210307218A1

公开(公告)日：2021-09-30

申请号：US17071408

申请日：2020-10-15

Applicant: QUALCOMM Incorporated

Inventor： Charles David PAYNTER ,  Ryan LANE ,  John EATON ,  Amit MANO

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/11 ,  H05K5/00 ,  H05K3/30

Abstract: A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.