公开(公告)号：US20230070275A1

公开(公告)日：2023-03-09

申请号：US17470924

申请日：2021-09-09

Applicant: QUALCOMM Incorporated

Inventor： Anirudh BHAT ,  Yuling NIU ,  Jay Scott SALMON

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532

Abstract: A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first pad interconnect. The first pad interconnect comprises a first portion comprising a first width and a second portion comprising a second width that is different than the first width.

公开(公告)号：US20230023868A1

公开(公告)日：2023-01-26

申请号：US17383241

申请日：2021-07-22

Applicant: QUALCOMM Incorporated

Inventor： Anirudh BHAT ,  Jay Scott SALMON

IPC: H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02

Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.