公开(公告)号：US20230091182A1

公开(公告)日：2023-03-23

申请号：US17482294

申请日：2021-09-22

Applicant: QUALCOMM Incorporated

Inventor： Chien-Te FENG ,  Wen YIN ,  Jay Scott SALMON

IPC: H01L23/522 ,  H01L23/36 ,  H01L23/00 ,  H01L23/60 ,  H01L21/56 ,  H01L23/31

Abstract: A device comprising a package and a board. The package includes a substrate comprising a first surface and a second surface, a passive component coupled to the first surface of the substrate, an integrated device coupled to the second surface of the substrate, a back side metal layer coupled to a back side of the integrated device, a first solder interconnect coupled to the back side metal layer, and a plurality of solder interconnects coupled to the second surface of the substrate. The board is coupled to the package through the plurality of solder interconnects. The first solder interconnect is coupled to the board.

公开(公告)号：US20230070275A1

公开(公告)日：2023-03-09

申请号：US17470924

申请日：2021-09-09

Applicant: QUALCOMM Incorporated

Inventor： Anirudh BHAT ,  Yuling NIU ,  Jay Scott SALMON

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532

Abstract: A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first pad interconnect. The first pad interconnect comprises a first portion comprising a first width and a second portion comprising a second width that is different than the first width.

公开(公告)号：US20230023868A1

公开(公告)日：2023-01-26

申请号：US17383241

申请日：2021-07-22

Applicant: QUALCOMM Incorporated

Inventor： Anirudh BHAT ,  Jay Scott SALMON

IPC: H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02

Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.