公开(公告)号：US20240055346A1

公开(公告)日：2024-02-15

申请号：US17888369

申请日：2022-08-15

Applicant: QUALCOMM Incorporated

Inventor： Prakash RATTAISUTRIPALAYAM PALANISAMY ,  Bruce LEE ,  Bavireddy SAI KRISHNA ,  Balavva Shivappa KAMATAGI

IPC: H01L23/522 ,  H01L23/528

CPC classification number: H01L23/5223 ,  H01L23/528

Abstract: A chip includes a first capacitor. The first capacitor includes first electrodes formed from metal layer M0, wherein the first electrodes are coupled to one another. The first capacitor also includes second electrodes formed from the metal layer M0, wherein the second electrodes are coupled to one another.