公开(公告)号：US20200381405A1

公开(公告)日：2020-12-03

申请号：US16426160

申请日：2019-05-30

Applicant: QUALCOMM Incorporated

Inventor： Aniket PATIL ,  Hong Bok WE ,  Bernie YANG

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683

Abstract: Certain aspects of the present disclosure generally relate to a chip assembly having an embedded passive device in a bottom package of a package-on-package (PoP) assembly. An example chip assembly generally includes a first package and a second package disposed above and coupled to the first package. The first package may include a redistribution layer, an integrated circuit die disposed above and coupled to the redistribution layer, and at least one reactive component disposed above the redistribution layer and coupled to the redistribution layer and the second package.