公开(公告)号：US20210358860A1

公开(公告)日：2021-11-18

申请号：US16874558

申请日：2020-05-14

Applicant: QUALCOMM Incorporated

Inventor： Supatta NIRAMARNKARN ,  Bin XU ,  Wen YIN ,  Yonghao AN

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/367 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: An integrated circuit (IC) package is described. The IC package includes a laminate substrate. The IC package also includes an active die on a surface of the laminate substrate. The IC package further includes fin-based thermal surface mount devices on the surface of the laminate substrate proximate the active die to provide an additional heat dissipation path.

公开(公告)号：US20170155536A1

公开(公告)日：2017-06-01

申请号：US15357711

申请日：2016-11-21

Applicant: QUALCOMM Incorporated

Inventor： Bin XU

IPC: H04L27/34 ,  H04L27/26

CPC classification number: H04L27/3405 ,  H04L27/2607 ,  H04L27/2627 ,  H04L27/345

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may include a processing system configured to map a data set based on a modulation scheme, to modulate the mapped data set based on a set of codes, the set of codes being orthogonal to a portion of a frame, and to generate the frame comprising the modulated data set in the portion of the frame. The apparatus may include an interface configured to output the frame for transmission.