公开(公告)号：US11439008B2

公开(公告)日：2022-09-06

申请号：US17149498

申请日：2021-01-14

Applicant: QUALCOMM Incorporated

Inventor： Kun Fang ,  Jaehyun Yeon ,  Suhyung Hwang ,  Hyunchul Cho ,  Boyu Tseng

IPC: H05K1/11 ,  H01L21/48 ,  H05K1/02

Abstract: A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.