公开(公告)号：US20210249177A1

公开(公告)日：2021-08-12

申请号：US16788484

申请日：2020-02-12

Applicant: QUALCOMM Incorporated

Inventor： Chunhu ZHANG ,  Ravi Kiran CHALLA ,  Daniel Daeik KIM ,  Chandra Sekhar Reddy KAIPA

IPC: H01F27/28 ,  H01Q7/04 ,  H01F41/04

Abstract: Certain aspects of the present disclosure generally relate to an electronic device having an inductive element made up of a plurality of metal layers including a metal shielding layer with one or more electrically floating metal pieces. One example electronic device has a plurality of metal layers that generally includes a bottom metal layer, one or more middle metal layers disposed above the bottom metal layer, wherein at least one of the middle layers comprises a coil, and a top metal layer disposed above the one or more middle metal layers. At least one of the bottom metal layer or the top metal layer comprises a shield layer. At least a first portion of a first region of the shield layer overlying or underlying the coil comprises one or more metal pieces that are electrically floating and are disconnected from the shield layer.