公开(公告)号：US20220406288A1

公开(公告)日：2022-12-22

申请号：US17353420

申请日：2021-06-21

Applicant: QUALCOMM Incorporated

Inventor： Kai LIU ,  Chunhu ZHANG ,  Chenliang DU

IPC: G10K11/36 ,  H03H7/01 ,  H03H9/02 ,  H03H9/64

Abstract: Disclosed is a radio frequency (RF) filter that vertically integrates an acoustic wave filter with an integrated passive device (IPD) filter. The acoustic wave filter provides selectivity at fundamental frequency band while the IPD filter provides rejection at harmonic frequency bands.

公开(公告)号：US20210249177A1

公开(公告)日：2021-08-12

申请号：US16788484

申请日：2020-02-12

Applicant: QUALCOMM Incorporated

Inventor： Chunhu ZHANG ,  Ravi Kiran CHALLA ,  Daniel Daeik KIM ,  Chandra Sekhar Reddy KAIPA

IPC: H01F27/28 ,  H01Q7/04 ,  H01F41/04

Abstract: Certain aspects of the present disclosure generally relate to an electronic device having an inductive element made up of a plurality of metal layers including a metal shielding layer with one or more electrically floating metal pieces. One example electronic device has a plurality of metal layers that generally includes a bottom metal layer, one or more middle metal layers disposed above the bottom metal layer, wherein at least one of the middle layers comprises a coil, and a top metal layer disposed above the one or more middle metal layers. At least one of the bottom metal layer or the top metal layer comprises a shield layer. At least a first portion of a first region of the shield layer overlying or underlying the coil comprises one or more metal pieces that are electrically floating and are disconnected from the shield layer.