公开(公告)号：US20240396227A1

公开(公告)日：2024-11-28

申请号：US18324114

申请日：2023-05-25

Applicant: QUALCOMM Incorporated

Inventor： Chien-Te Feng ,  Jay Scott Salmon ,  Wen Yin

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q1/38

Abstract: An antenna module having an antenna in a mold layer, and related fabrication methods are disclosed. The antenna module includes a substrate that supports one or more semiconductor dies (“dies”). The die(s) can include radio-frequency (RF) circuits. A mold layer is formed over the die(s) and the package substrate to insulate and protect the die(s). The antenna is electrically coupled to the die(s). In exemplary aspects, an antenna (e.g., an antenna patch, waveguide, and/or dipole antenna elements) is provided in the mold layer. For example, the antenna can be formed in the mold layer adjacent to the die(s), wherein the antenna is electrically coupled to the die(s) through the substrate. In this manner, the mold layer can be provided having a desired dielectric constant to achieve better attenuation characteristics for the antenna to meet the performance requirements for supporting higher frequencies as an example.

公开(公告)号：US12100649B2

公开(公告)日：2024-09-24

申请号：US17482294

申请日：2021-09-22

Applicant: QUALCOMM Incorporated

Inventor： Chien-Te Feng ,  Wen Yin ,  Jay Scott Salmon

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/522 ,  H01L23/60

CPC classification number: H01L23/5226 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/60 ,  H01L24/20

Abstract: A device comprising a package and a board. The package includes a substrate comprising a first surface and a second surface, a passive component coupled to the first surface of the substrate, an integrated device coupled to the second surface of the substrate, a back side metal layer coupled to a back side of the integrated device, a first solder interconnect coupled to the back side metal layer, and a plurality of solder interconnects coupled to the second surface of the substrate. The board is coupled to the package through the plurality of solder interconnects. The first solder interconnect is coupled to the board.