公开(公告)号：US20170271919A1

公开(公告)日：2017-09-21

申请号：US15267639

申请日：2016-09-16

Applicant: QUALCOMM Incorporated

Inventor： William Henry VON NOVAK, III ,  Mei-Li CHI ,  Ravindra SHENOY ,  Rashid Ahmed Akbar ATTAR ,  Karim ARABI ,  Donald KIDWELL, JR. ,  Jon LASITER

IPC: H02J50/05 ,  H02J50/15 ,  H02J50/90 ,  H02J50/12

CPC classification number: H02J50/05 ,  A61N1/3787 ,  H02J7/025 ,  H02J50/10 ,  H02J50/12 ,  H02J50/15 ,  H02J50/50 ,  H02J50/90

Abstract: A method of providing power to an implant includes: transcutaneously receiving first power wirelessly from a source transmitter by a receiver of a power relay device, the receiver of the power relay device being disposed inside a biological body and closer to a skin of the biological body than the implant is to the skin of the biological body; converting the first power into second power that has a substantially different frequency than the first power, or is of different type of power than the first power, or both; and internally coupling the second power from a transmitter of the power relay device to the implant disposed within the biological body.