公开(公告)号：US10582609B2

公开(公告)日：2020-03-03

申请号：US15798071

申请日：2017-10-30

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Jonghae Kim ,  Xiaoju Yu ,  Mario Francisco Velez ,  Wei-Chuan Chen ,  Niranjan Sunil Mudakatte ,  Matthew Michael Nowak ,  Christian Hoffmann ,  Rodrigo Pacher Fernandes ,  Manuel Hofer ,  Peter Bainschab ,  Edgar Schmidhammer ,  Stefan Leopold Hatzl

IPC: H05K1/02 ,  H05K3/32 ,  H03H9/02 ,  H03H9/10 ,  H03H3/02 ,  H03H9/05 ,  H03H3/08

Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.