公开(公告)号：US20210296246A1

公开(公告)日：2021-09-23

申请号：US17017361

申请日：2020-09-10

Applicant: QUALCOMM Incorporated

Inventor： Ryan LANE ,  Li-Sheng WENG ,  Charles David PAYNTER ,  Eric David FORONDA

IPC: H01L23/538 ,  H01L25/065 ,  H01L25/00

Abstract: A package comprising a substrate, an integrated device, and an interconnect integrated device. The substrate includes a first surface and a second surface. The substrate further includes a plurality of interconnects. The integrated device is coupled to the substrate. The interconnect integrated device is coupled to a surface of the substrate. The integrated device, the interconnect integrated device and the substrate are configured to provide an electrical path for an electrical signal of the integrated device, that travels through at least the substrate, then through the interconnect integrated device and back through the substrate.