公开(公告)号：US10393594B2

公开(公告)日：2019-08-27

申请号：US15675604

申请日：2017-08-11

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar Merrikh ,  Farsheed Mahmoudi ,  Mehdi Saeidi ,  Evan Bentley Fleming

IPC: H01L35/32 ,  G01K7/02 ,  G01K1/02 ,  G01K7/04 ,  G06F17/12 ,  G06F17/16 ,  G01K3/14

Abstract: A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.