公开(公告)号：US10224264B1

公开(公告)日：2019-03-05

申请号：US15724283

申请日：2017-10-04

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar Merrikh ,  Mehdi Saeidi ,  Guoping Xu ,  Damion Gastelum ,  Luis Eduardo De Los Heros Beunza ,  Ajay Vadakkepatt ,  Rama Rao Goruganthu

IPC: H01L23/427 ,  H01L23/04

Abstract: Aspects of the disclosure are directed to a package including a substrate, die coupled to the substrate, wick deposited on the die, and an evaporation-condensation chamber having a hollowed bottom and two bottom lips, wherein the wick mates into the hollowed enclosure and substantially merges with the two bottom lips forming a sealed chamber. Other aspects are directed to a method of forming a package including coupling a die to a substrate, depositing a wick on the die, and mating the wick with an evaporation-condensation chamber having a hollowed enclosure and two bottom lips, wherein the mating attaches the wick into the hollowed enclosure and substantially merges the wick with the two bottom lips forming a sealed chamber. By directly depositing the wick over the die and integrating the wick with the encapsulation-condensation chamber, this integrated solution provides significant improvement in package thermal resistance especially for high-power and high-performance applications.

公开(公告)号：US10393594B2

公开(公告)日：2019-08-27

申请号：US15675604

申请日：2017-08-11

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar Merrikh ,  Farsheed Mahmoudi ,  Mehdi Saeidi ,  Evan Bentley Fleming

IPC: H01L35/32 ,  G01K7/02 ,  G01K1/02 ,  G01K7/04 ,  G06F17/12 ,  G06F17/16 ,  G01K3/14

Abstract: A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.

公开(公告)号：US10309838B2

公开(公告)日：2019-06-04

申请号：US15260194

申请日：2016-09-08

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar Merrikh ,  Martin Saint-Laurent ,  Mohammad Ghasemazar ,  Rajit Chandra ,  Mohamed Allam

IPC: G01K1/20 ,  G01K1/14 ,  G01K7/01 ,  G01K7/42 ,  G06F1/20 ,  G01K15/00

Abstract: A temperature sensor position offset error correction power implementation include monitors (e.g., digital power monitor/meter) to measure activity on a die, and uses the activity measurements to compute real-time temperature offsets by converting activity to power, which can be used in a simplified compact thermal model. A system on chip including the die receives a temperature measurement of a region of the system on chip from a sensor. Power consumed by the region is estimated based on the measured activity, and temperature measurement of the system on chip is adjusted based on the estimated power.

公开(公告)号：US20170220384A1

公开(公告)日：2017-08-03

申请号：US15486820

申请日：2017-04-13

Applicant: QUALCOMM Incorporated

Inventor： Jon James Anderson ,  Richard Alan Stewart ,  Ali Akbar Merrikh ,  Chris Platt ,  Hans Lee Yeager ,  Ryan Donovan Wells

IPC: G06F9/50 ,  G06F11/20 ,  G06F9/48

CPC classification number: G06F11/203 ,  G06F9/4893 ,  G06F9/5083 ,  G06F11/2028 ,  G06F2201/805 ,  G06F2201/81 ,  G06F2201/82 ,  Y02D10/24

Abstract: Aspects include computing devices, systems, and methods for managing a first computing device component of a computing device in order to extend an operating life of the computing device component. In an aspect, a processing device may determine a condition estimator of the first computing device component, determine whether the condition estimator of the first computing device component indicates that a condition of the first computing device component is worse than the condition of a second computing device component, and assign workloads to the first and second computing device components to balance deterioration of the condition of the first and second computing device components in response to determining that the condition estimator of the first computing device component indicates that the condition of the first computing device component is worse than the condition of the second computing device component.

公开(公告)号：US10261875B2

公开(公告)日：2019-04-16

申请号：US15486820

申请日：2017-04-13

Applicant: QUALCOMM Incorporated

Inventor： Jon James Anderson ,  Richard Alan Stewart ,  Ali Akbar Merrikh ,  Christopher Platt ,  Hans Lee Yeager ,  Ryan Donovan Wells

IPC: G06F9/44 ,  G06F11/20 ,  G06F9/48 ,  G06F9/50

Abstract: Aspects include computing devices, systems, and methods for managing a first computing device component of a computing device in order to extend an operating life of the computing device component. In an aspect, a processing device may determine a condition estimator of the first computing device component, determine whether the condition estimator of the first computing device component indicates that a condition of the first computing device component is worse than the condition of a second computing device component, and assign workloads to the first and second computing device components to balance deterioration of the condition of the first and second computing device components in response to determining that the condition estimator of the first computing device component indicates that the condition of the first computing device component is worse than the condition of the second computing device component.

公开(公告)号：US10159165B2

公开(公告)日：2018-12-18

申请号：US15423474

申请日：2017-02-02

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Ali Akbar Merrikh ,  Melika Roshandell

IPC: H05K7/20 ,  H01L23/427 ,  G06F1/20 ,  H01L23/473 ,  H05K1/02

Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

公开(公告)号：US10168222B2

公开(公告)日：2019-01-01

申请号：US15474914

申请日：2017-03-30

Applicant: QUALCOMM Incorporated

Inventor： Rama Rao Goruganthu ,  Ali Akbar Merrikh

IPC: G01J5/10 ,  G01J5/08 ,  G01J5/02 ,  G01J5/06

Abstract: An apparatus is disclosed that comprises an integrated circuit and a thermal detector array configured to detect thermal radiation from the integrated circuit. A method is disclosed that comprises providing an integrated circuit and disposing a thermal detector array so as to detect thermal radiation from the integrated circuit. Another apparatus is disclosed that comprises means for processing and means for detecting thermal radiation from the means for processing.