公开(公告)号：US20180301791A1

公开(公告)日：2018-10-18

申请号：US15953236

申请日：2018-04-13

Applicant: Qualcomm Incorporated

Inventor： Zhang JIN ,  Jeong II Kim

IPC: H01Q1/24 ,  H01Q9/18 ,  H01Q9/26

Abstract: Certain aspects of the present disclosure generally relate to wireless communication. In some aspects, an antenna module may include a substrate; a first dipole antenna positioned such that conductive components of the first dipole antenna are oriented on a first plane that is approximately parallel to a mounting surface of the substrate; and a second dipole antenna positioned such that conductive components of the second dipole antenna are oriented on a second plane that is approximately perpendicular to the mounting surface of the substrate, wherein the second dipole antenna is positioned to cover a broadside radiation pattern approximately perpendicular to the mounting surface. Numerous other aspects are provided.

公开(公告)号：US10886608B2

公开(公告)日：2021-01-05

申请号：US15922827

申请日：2018-03-15

Applicant: QUALCOMM Incorporated

Inventor： Jeong II Kim ,  Jorge Fabrega Sanchez ,  Mohammad Ali Tassoudji ,  Abbas Abbaspour-Tamijani ,  Yu-Chin Ou ,  Zhang Jin ,  Thomas Myers

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q25/00 ,  H01Q21/00 ,  H01Q13/10 ,  H01Q15/24

Abstract: In an aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a transceiver, a memory, and at least one processor coupled to the memory and configured to execute instructions stored in the memory to control the transceiver. In another aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a patch antenna coupled to the transceiver. The patch antenna includes a patch, a ground plane substantially located with respect to the patch, a probe feed coupled to the patch, and a slot-coupled feed configured to couple to the patch.