公开(公告)号：US20190103653A1

公开(公告)日：2019-04-04

申请号：US16145100

申请日：2018-09-27

申请人： QUALCOMM Incorporated

发明人： Seong Heon JEONG ,  Rajneesh KUMAR ,  Mohammad Ali TASSOUDJI ,  Darryl JESSIE ,  Gurkanwal SAHOTA ,  Kevin Hsi Huai WANG ,  Jeong KIM, II ,  Taesik YANG ,  Thomas MYERS ,  Neil BURNS ,  Julio ZEGARRA ,  Clinton James WILBER ,  Jordan SZABO

IPC分类号： H01Q1/22 ,  H01Q1/52 ,  H01L23/552 ,  H01L23/66 ,  H01L23/64 ,  H01L23/28

摘要： An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.