公开(公告)号：US20190103653A1

公开(公告)日：2019-04-04

申请号：US16145100

申请日：2018-09-27

申请人： QUALCOMM Incorporated

发明人： Seong Heon JEONG ,  Rajneesh KUMAR ,  Mohammad Ali TASSOUDJI ,  Darryl JESSIE ,  Gurkanwal SAHOTA ,  Kevin Hsi Huai WANG ,  Jeong KIM, II ,  Taesik YANG ,  Thomas MYERS ,  Neil BURNS ,  Julio ZEGARRA ,  Clinton James WILBER ,  Jordan SZABO

IPC分类号： H01Q1/22 ,  H01Q1/52 ,  H01L23/552 ,  H01L23/66 ,  H01L23/64 ,  H01L23/28

摘要： An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

公开(公告)号：US20220166127A1

公开(公告)日：2022-05-26

申请号：US17666549

申请日：2022-02-07

申请人： QUALCOMM Incorporated

发明人： Seong Heon JEONG ,  Rajneesh KUMAR ,  Mohammad Ali TASSOUDJI ,  Darryl JESSIE ,  Gurkanwal SAHOTA ,  Kevin Hsi Huai WANG ,  Jeong IL KIM ,  Taesik YANG ,  Thomas MYERS ,  Neil BURNS ,  Julio ZEGARRA ,  Clinton James WILBER ,  Jordan SZABO

IPC分类号： H01Q1/22 ,  H01L25/065 ,  H01Q1/24 ,  H01L23/28 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/52

摘要： An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

公开(公告)号：US20180269585A1

公开(公告)日：2018-09-20

申请号：US15922827

申请日：2018-03-15

申请人： QUALCOMM Incorporated

发明人： Jeong Il KIM ,  Jorge FABREGA SANCHEZ ,  Mohammad Ali TASSOUDJI ,  Abbas ABBASPOUR-TAMIJANI ,  Yu-Chin OU ,  Zhang JIN ,  Thomas MYERS

IPC分类号： H01Q13/10 ,  H01Q9/04 ,  H01Q15/24

CPC分类号： H01Q13/10 ,  H01Q1/523 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q15/242 ,  H01Q21/0006 ,  H01Q21/065 ,  H01Q21/24 ,  H01Q25/001

摘要： In an aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a transceiver, a memory, and at least one processor coupled to the memory and configured to execute instructions stored in the memory to control the transceiver. In another aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a patch antenna coupled to the transceiver. The patch antenna includes a patch, a ground plane substantially located with respect to the patch, a probe feed coupled to the patch, and a slot-coupled feed configured to couple to the patch.