公开(公告)号：US20250052812A1

公开(公告)日：2025-02-13

申请号：US18447446

申请日：2023-08-10

Applicant: QUALCOMM Incorporated

Inventor： Amit ANEJA ,  Dipti Ranjan PAL ,  Kiran Kumar MALIPEDDI

IPC: G01R31/317

Abstract: Methods and apparatuses directed to. In some examples, a die package includes voltage logic that provides a voltage to a voltage rail, clock logic that generates a clock signal, and adaptive clock distribution logic that receives the clock signal and the voltage. The adaptive clock distribution logic can increment an event count when the clock signal is above a threshold frequency, or when the voltage is below a threshold voltage level. The die package also includes a processor that can monitor the event counts during operation and determine a status of the adaptive clock distribution logic based on the event counts. In some examples, the processor can test the adaptive clock distribution logic by causing the clock signal to operate above the threshold frequency, or causing the voltage logic to provide the voltage below the threshold voltage level. The processor can then read the event counts to determine the status.

公开(公告)号：US20230203796A1

公开(公告)日：2023-06-29

申请号：US18181035

申请日：2023-03-09

Applicant: QUALCOMM Incorporated

Inventor： Kiran Kumar MALIPEDDI ,  Rahul GULATI

IPC: E03C1/046

CPC classification number: E03C1/0465

Abstract: Various embodiments include components (e.g., a processor in a vehicle advanced driver assistance system) configured to identify subsystems that require testing in order to verify their compliance with a safety requirement. The components may determine whether verification of compliance requires that the subsystems be tested at PON, at POFF, during runtime or a combination thereof, dynamically determine the achievable parallelism for testing the identified subsystems, dynamically determine coverage level requirements for performing or executing built in self tests (BISTs) on each identified subsystem, and perform or execute the BISTs on the subsystems at the determined level of parallel and at the determined coverage level.

公开(公告)号：US20220243437A1

公开(公告)日：2022-08-04

申请号：US17161731

申请日：2021-01-29

Applicant: QUALCOMM Incorporated

Inventor： Kiran Kumar MALIPEDDI ,  Rahul GULATI

IPC: E03C1/046

Abstract: Various embodiments include components (e.g., a processor in a vehicle advanced driver assistance system) configured to identify subsystems that require testing in order to verify their compliance with a safety requirement. The components may determine whether verification of compliance requires that the subsystems be tested at PON, at POFF, during runtime or a combination thereof, dynamically determine the achievable parallelism for testing the identified subsystems, dynamically determine coverage level requirements for performing or executing built in self tests (BISTs) on each identified subsystem, and perform or execute the BISTs on the subsystems at the determined level of parallel and at the determined coverage level.