公开(公告)号：US20240162155A1

公开(公告)日：2024-05-16

申请号：US17988642

申请日：2022-11-16

Applicant: QUALCOMM Incorporated

Inventor： Lili XU ,  Jason GONZALEZ

IPC: H01L23/538 ,  H01L23/64 ,  H01L25/16 ,  H01L49/02

CPC classification number: H01L23/5383 ,  H01L23/645 ,  H01L25/16 ,  H01L28/40 ,  H01L24/16 ,  H01L2224/16227

Abstract: A device comprising a substrate, a first integrated device coupled to a first surface of the substrate, a second integrated device coupled to the first surface of the substrate, a first passive device coupled to a second surface of the substrate and a second passive device coupled to the second surface of the substrate. The substrate comprises at least one dielectric layer and a plurality of interconnects. The plurality of interconnects include a power interconnect. The power interconnect is configured to be electrically coupled to power. The first integrated device, the first passive device, the second integrated device and the second passive device are configured to be electrically coupled to the power interconnect through a first plurality of interconnects from the plurality of interconnects. The first plurality of interconnects are configured to operate as an inductor, where the first plurality of interconnects include a via interconnect.