公开(公告)号：US20220415868A1

公开(公告)日：2022-12-29

申请号：US17358838

申请日：2021-06-25

Applicant: QUALCOMM Incorporated

Inventor： Abinash ROY ,  Lohith Kumar VEMULA ,  Bharani CHAVA ,  Jonghae KIM

IPC: H01L25/16 ,  H01L23/13 ,  H01L21/48 ,  H01L23/498 ,  H01L23/64

Abstract: A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a first interconnect and a second interconnect, a capacitor located at least partially in the substrate, the capacitor comprising a first terminal and a second terminal, a first solder interconnect coupled to a first side surface of the first terminal and the first interconnect, and a second solder interconnect coupled to a second side surface of the second terminal and the second interconnect.