公开(公告)号：US20190067219A1

公开(公告)日：2019-02-28

申请号：US15686131

申请日：2017-08-24

Applicant: QUALCOMM Incorporated

Inventor： Jon Bradley LASITER ,  Ravindra Vaman SHENOY ,  Donald William KIDWELL, JR. ,  Mohammad TASSOUDJI ,  Mario Francisco VELEZ

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01Q1/22

Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.

公开(公告)号：US20200021010A1

公开(公告)日：2020-01-16

申请号：US16035324

申请日：2018-07-13

Applicant: QUALCOMM Incorporated

Inventor： Yu-Chin OU ,  Mohammad TASSOUDJI

IPC: H01Q1/24 ,  H01Q21/06 ,  H04M1/02 ,  H01Q1/38 ,  H01Q1/42

Abstract: Techniques are provided for improving the performance of a wideband antenna in a mobile device. An example of an apparatus according to the disclosure includes a first radiator formed on a first plane of a wireless device, a device cover including an inside surface formed on a second plane that is above and parallel to the first plane, and a second radiator disposed on the inside surface of the device cover, such that at least a portion the second radiator is located in an area that is orthogonal to the first radiator.