公开(公告)号：US20180054682A1

公开(公告)日：2018-02-22

申请号：US15677427

申请日：2017-08-15

Applicant: QUALCOMM Incorporated

Inventor： Ravindra SHENOY ,  Rohit SAUHTA ,  Elbert MCLAREN ,  Sidney SITACHITT ,  Donald William KIDWELL, JR.

IPC: H04R25/00 ,  H04R1/10

CPC classification number: H04R25/554 ,  H04R1/1016 ,  H04R1/1025 ,  H04R25/35 ,  H04R2225/023 ,  H04R2225/025 ,  H04R2225/31 ,  H05K1/028 ,  H05K1/18 ,  H05K2201/10083

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：US20190164681A1

公开(公告)日：2019-05-30

申请号：US15826735

申请日：2017-11-30

Applicant: QUALCOMM Incorporated

Inventor： Donald William KIDWELL, JR. ,  Ravindra Vaman SHENOY ,  Alan LEWIS ,  Christopher Feuling FERGUSON

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/24 ,  H01F41/04 ,  H01F41/12 ,  H05K1/18 ,  H01L23/498 ,  H01L23/64 ,  H01L23/00

Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.

公开(公告)号：US20170343346A1

公开(公告)日：2017-11-30

申请号：US15169503

申请日：2016-05-31

Applicant: QUALCOMM Incorporated

Inventor： Firas SAMMOURA ,  Stephanie FUNG ,  Donald William KIDWELL, JR. ,  Ravindra Vaman SHENOY ,  David William BURNS

IPC: G01C9/20 ,  G01F23/296

CPC classification number: G01C9/20 ,  G01C9/18 ,  G01F23/2965

Abstract: A device may include a surface at least partially defining an enclosed region, a plurality of fluids within the enclosed region, the plurality of fluids comprising at least a first fluid having a first acoustic impedance and a second fluid having a second acoustic impedance different from the first acoustic impedance, a first piezoelectric transducer disposed on the surface, the first piezoelectric transducer being configured to generate a first wave reception signal based, at least in part, on an ultrasonic return wave received through at least one of the plurality of fluids, and a processor coupled to the first piezoelectric transducer and configured to determine a measurement of a tilt of the device based, at least in part, on the first wave reception signal.

公开(公告)号：US20220116717A1

公开(公告)日：2022-04-14

申请号：US17517439

申请日：2021-11-02

Applicant: QUALCOMM Incorporated

Inventor： Ravindra SHENOY ,  Rohit SAUHTA ,  Elbert MCLAREN ,  Sidney SITACHITT ,  Donald William KIDWELL, JR.

IPC: H04R25/00 ,  H04R1/10

Abstract: A device comprising a first printed circuit board (PCB); a second printed circuit board (PCB); a first flex board coupled to the first PCB and the second PCB; a first integrated device coupled to the first PCB; a speaker configured to be coupled to the first integrated device; a microphone configured to be coupled to the first integrated device; a second integrated device coupled to the second PCB, wherein the second integrated device is configured to be coupled to the first integrated device through the second PCB, the first flex board and the first PCB; and a power source configured to provide power to the first integrated device and the second integrated device. The first PCB is located between the power source and the first integrated device. The second PCB is located between the power source and the second integrated device.

公开(公告)号：US20190067221A1

公开(公告)日：2019-02-28

申请号：US15839831

申请日：2017-12-12

Applicant: QUALCOMM Incorporated

Inventor： Jon Bradley LASITER ,  Ravindra Vaman SHENOY ,  Donald William KIDWELL, JR. ,  Mohammad Ali TASSOUDJI ,  Vladimir APARIN ,  Seong Heon JEONG ,  Jeremy DUNWORTH ,  Alireza MOHAMMADIAN ,  Mario Francisco VELEZ ,  Chin-Kwan KIM

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L23/31 ,  H01L21/50 ,  H01Q1/22 ,  H01Q1/24

Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

公开(公告)号：US20190067219A1

公开(公告)日：2019-02-28

申请号：US15686131

申请日：2017-08-24

Applicant: QUALCOMM Incorporated

Inventor： Jon Bradley LASITER ,  Ravindra Vaman SHENOY ,  Donald William KIDWELL, JR. ,  Mohammad TASSOUDJI ,  Mario Francisco VELEZ

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01Q1/22

Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.

公开(公告)号：US20220383018A1

公开(公告)日：2022-12-01

申请号：US17303241

申请日：2021-05-25

Applicant: QUALCOMM Incorporated

Inventor： Russell GRUHLKE ,  Ravishankar SIVALINGAM ,  Donald William KIDWELL, JR. ,  Edwin Chongwoo PARK

IPC: G06K9/00 ,  G06K9/20 ,  G06F21/32

Abstract: In some aspects, a device may detect that an object is contacting a display of the device. The device may illuminate, based at least in part on detecting that the object is contacting the display, a plurality of pixel regions of the display. The plurality of pixel regions may be illuminated sequentially. The device may obtain, using one or more photosensors, a set of data relating to light that is reflected from at least a portion of the object based at least in part on illuminating the plurality of pixel regions. The set of data may include respective data for each sequential illumination of the plurality of pixel regions. The device may generate an image of at least the portion of the object based at least in part on the set of data. Numerous other aspects are described.

公开(公告)号：US20210398314A1

公开(公告)日：2021-12-23

申请号：US16904466

申请日：2020-06-17

Applicant: QUALCOMM Incorporated

Inventor： Ravishankar SIVALINGAM ,  Donald William KIDWELL, JR. ,  Russell GRUHLKE ,  Edwin Chongwoo PARK ,  Khurshid Syed ALAM

IPC: G06T7/73 ,  G06F3/01 ,  G06F3/0346 ,  H04N5/247

Abstract: Systems, methods, and non-transitory media are provided for low-power visual tracking systems. An example method can include receiving one or more images captured by each image sensor system from a set of image sensor systems on a first device, the one or more images capturing a set of patterns on a second device, wherein the first device has lower power requirements than the second device, the set of patterns having a predetermined configuration on the second device; determining, from the one or more images captured by each image sensor system, a set of pixels corresponding to the set of patterns on the second device; determining, based on the set of pixels corresponding to the set of patterns, a location and relative pose in space of each pattern; and determining, based on the location and relative pose of each pattern, a pose of the first device relative to the second device.

公开(公告)号：US20210175636A1

公开(公告)日：2021-06-10

申请号：US16704405

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Jon LASITER ,  Donald William KIDWELL, JR. ,  Ravindra Vaman SHENOY ,  Mohammad Ali TASSOUDJI ,  Jeremy Darren DUNWORTH ,  Vladimir Aparin ,  Yu-Chin OU ,  Seong Heon JEONG

IPC: H01Q21/06 ,  H01Q21/26 ,  H01Q9/28

Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.

公开(公告)号：US20180342788A1

公开(公告)日：2018-11-29

申请号：US15708084

申请日：2017-09-18

Applicant: QUALCOMM Incorporated

Inventor： Jon Bradley LASITER ,  Ravindra Vaman SHENOY ,  Donald William KIDWELL, JR. ,  Mohammad Ali TASSOUDJI ,  Mario Francisco VELEZ

IPC: H01Q1/22 ,  H01Q1/46 ,  H01L27/146 ,  H05K3/30 ,  H01Q21/00 ,  H01L21/02

Abstract: The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.