公开(公告)号：US20150318229A1

公开(公告)日：2015-11-05

申请号：US14702276

申请日：2015-05-01

Applicant: QUALCOMM Incorporated

Inventor： Jianwen XU ,  Lizabeth Ann KESER ,  William STONE ,  Steve Joseph BEZUK ,  Nicholas Ka Ming YU

IPC: H01L23/31 ,  H01L23/532 ,  H01L23/498 ,  H01L23/528

CPC classification number: H01L23/3114 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/525 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5329 ,  H01L29/0657 ,  H01L2224/11

Abstract: A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer.

Abstract translation: 晶片级封装器件可以包括封装衬底，衬底的后端和衬底上的线层前端的模制化合物以及再分配层的钝化层，而不在钝化层上封装金属层。