公开(公告)号：US20240411718A1

公开(公告)日：2024-12-12

申请号：US18333377

申请日：2023-06-12

Applicant: QUALCOMM Incorporated

Inventor： Sandeep PANDE ,  Satish SINGH ,  Colin Beaton VERRILLI ,  Natarajan VAIDHYANATHAN ,  Vinay MURTHY

IPC: G06F15/80 ,  G06F9/50

Abstract: A machine learning (ML)-accelerator system-on-chip (SoC) is described. The ML-accelerator SoC includes a set of ML-accelerator cores. The ML-accelerator SoC also includes a network-on-chip (NoC) coupled to the set of ML-accelerator cores. The ML-accelerator SoC further includes an inference video post processing (infVPP) module coupled to the NoC. The ML-accelerator SoC also includes a video decoder coupled to the NoC.