公开(公告)号：US20250068227A1

公开(公告)日：2025-02-27

申请号：US18452880

申请日：2023-08-21

Applicant: QUALCOMM Incorporated

Inventor： Louis LOUIE ,  Ronald ALTON ,  Sumarlin WILLIAM ,  Vinayak Nana MEHETRE

IPC: G06F1/3287 ,  G06F1/3206 ,  G06N3/045

Abstract: Thermal management aspects include a serial databus; a central processing unit (CPU); a graphics processing unit (GPU); a neural signal processor (NSP); an always on subsystem (AOSS); the serial databus, the CPU, the GPU, the NSP and the AOSS are implemented on a system on a chip; wherein the CPU includes a first plurality of thermal sensors and a first plurality of controllers, each of the first plurality of thermal sensors is coupled to each of the first plurality of controllers; wherein the NSP includes a second plurality of thermal sensors and a second plurality of controllers, each of the second plurality of thermal sensors is coupled to each of the second plurality of controllers; and wherein the AOSS includes a third plurality of thermal sensors and a third plurality of controllers, each of the third plurality of thermal sensors is coupled to each of the third plurality of controllers.