公开(公告)号：US20230403753A1

公开(公告)日：2023-12-14

申请号：US17839818

申请日：2022-06-14

Applicant: QUALCOMM Incorporated

Inventor： Xiaolong HUANG ,  Rajkumar VENKADASAMY MANOHARAN ,  Abhishek Pramod PATIL ,  Sai Yiu Duncan HO ,  Vasanthakumar THIAGARAJAN

IPC: H04W76/15 ,  H04W76/11

CPC classification number: H04W76/15 ,  H04W76/11 ,  H04W84/12

Abstract: This disclosure includes a multi-link device (MLD) transmitting a frame on a first communication link associated with a first device of the MLD, the frame carrying a plurality of addresses of a respective plurality of peer devices associated with a mesh basis service set (MBSS), each of the plurality of addresses associated with one of a per-link address of the first communication link of the MLD or a medium access control (MAC) address of the MLD. In some instances, the addresses include first and second addresses indicating respective receiver and transmitter addressees of a peering instance, and include third and fourth addresses indicating respective MBSS egress and MBSS ingress points of the peering instance. The first and second addresses are associated with the per-link address of the first communication link, and the third and fourth addresses are associated with the MLD MAC address.