公开(公告)号：US20180175798A1

公开(公告)日：2018-06-21

申请号：US15413019

申请日：2017-01-23

Applicant: QUALCOMM Incorporated

Inventor： Jose Cabanillas ,  Marco Cassia ,  Wei Tai

IPC: H03F1/02 ,  H03F3/19 ,  H03F3/24

CPC classification number: H03F1/0277 ,  H03F1/565 ,  H03F3/195 ,  H03F3/211 ,  H03F3/245 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/171 ,  H03F2200/222 ,  H03F2200/267 ,  H03F2200/318 ,  H03F2200/378 ,  H03F2200/387 ,  H03F2200/411 ,  H03F2200/429 ,  H03F2200/432 ,  H03F2200/451 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2203/21157 ,  H03F2203/7209 ,  H03F2203/7215 ,  H03F2203/7236 ,  H04B1/04 ,  H04B1/0483

Abstract: Methods, devices, apparatuses, and systems provide an efficient architecture for multi-mode amplifier modules by combining components of parallel transmit paths and reducing the number of total components used in amplifier modules. One such an amplifier module, including a first transmit path connected in parallel to a second transmit path between an input of the amplifier module and an intermediate node. The amplifier module further includes a common path connected to the intermediate node and an output of the amplifier module. The common path includes one or more shared components for a signal routed through either the first and second transmit paths.