公开(公告)号：US20240421119A1

公开(公告)日：2024-12-19

申请号：US18336331

申请日：2023-06-16

Applicant: QUALCOMM Incorporated

Inventor： Yangyang Sun ,  Yue Li ,  Lily Zhao ,  Piyush Gupta ,  Xuefeng Zhang

IPC: H01L23/00

Abstract: Flexible under-bump metallization sizes and patterning, and related integrated circuit packages and fabrication methods are disclosed. First under-bump metallizations (UBMs) of a first, larger size and pitch are provided in the die and coupled to corresponding metal interconnects in the package substrate. One or more second UBMs of a second, reduced size UBMs can also be located in the core area of the die. This provides greater flexibility in the design and layout of the die, because different circuits within the die (e.g., I/O related circuits) may only require coupling to smaller size UBMs for performance requirements and thus can be more flexibility located in the die. Also, to further reduce pitch of the second, smaller size UBMs, one or more of the second, smaller size UBMs can be formed as oblong-shaped UBMs, which can still maintain a minimum separation based on metal interconnect pitch limitations in the package substrate.

公开(公告)号：US11417622B2

公开(公告)日：2022-08-16

申请号：US17071432

申请日：2020-10-15

Applicant: QUALCOMM Incorporated

Inventor： Yangyang Sun ,  John Holmes ,  Xuefeng Zhang ,  Dongming He

IPC: H01L23/00

Abstract: Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.